Electronics Forum | Mon Sep 26 18:53:30 EDT 2016 | chabscan
Could it be possible in my Quad 4c, to increase component size tolerance to reduce the rejection of components? Could this have an impact in the event of the machine picking a component off center? As in if the machine picks a compnent off center but
Electronics Forum | Sat Sep 29 19:04:13 EDT 2012 | e_music
Hello, I have just installed the demo version of GC-Powerplace. Could anyone here walk me through the process to generate pick and place file from gerbers? I don't have solderpaste layer. All I have got is signal layers (top/bottom), soldermask, sil
Electronics Forum | Fri Jan 16 07:48:29 EST 2004 | Mika
We usually program the components in the component database with pin 1 in the lower left corner. Then in the feeder database we set the component orientaion to 270 deg for Tray feeders(turn the tray in the feeder 180 deg) and "tube" feeders. For tape
Electronics Forum | Wed Jan 14 14:58:21 EST 2004 | Gilroy Misquita
I would like to know if there is an International standard for BGA and QFP polarity in trays for pick and place. How are these components placed on trays and is there a polarity of the tray itself? Please feel free to send me an email or reply on t
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
Electronics Forum | Fri Jul 16 09:03:40 EDT 2004 | russ
A couple of thoughts, 1. buy larger quantity reels and load more trays of the same P/N if your problem is replenishing the machine. 2. If you're talking about changeover I would suggest that the feeders be set up in the kitting process and deliverd
Electronics Forum | Fri Dec 27 12:47:21 EST 2019 | ameenullakhan
Dear Team, We are facing open solder issue in a sensor component. Rejection rate is 2 out of 50 components placed. The issue is very random. We have tried increasing the solder paste height from 5 mil to 7 mil. The issue persist still. Differen
Electronics Forum | Thu Nov 13 10:05:18 EST 2014 | grimus
Hello, I'm fighting with problems of random solder balls that appears after reflow soldering around Pin in Paste component. I'm mounting this component with Pick and Place machine. I'm using solder paste type-3 and this is lead free product. This is
Electronics Forum | Wed May 08 04:46:25 EDT 2013 | mbb
Hello, I want to ask what are causes that could engender rejected components in Panasonic pick and place machine?
Electronics Forum | Tue Sep 26 10:44:28 EDT 2006 | Brad Courtemanche
Hi larry, don't know if you resolved your problem but if machine is picking part three times, rejecting all three but places number fourth your nozzle pickup is misaligned very slightly. During the first three pickups the nozzle is finally seating it
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