Electronics Forum | Sun Dec 15 14:32:46 EST 2002 | Carl Brytz
arzu, We have BOM parsing and normalization tools with revision management capabilties. We would like to discuss this with you as well determine what other functional requirements you may have. Depending your location one of our Applications Engine
Electronics Forum | Thu May 29 12:53:36 EDT 2003 | designchain
Managing items and BOMs, even for a small company, should not be done on spreadsheets - they're single user, prone to error, and hard to manage. There are relatively low-cost, very functional systems on the market that enable management and revision
Electronics Forum | Tue Jan 09 12:51:14 EST 2007 | aj
All, We have ran a few revisions of a New Product which is a tracking device using satellite navigation. The protos went well but now they have added a shielding can. We place 2 of these to cover the Frontend of the PCB. The test guys are having d
Electronics Forum | Tue Jul 04 20:31:21 EDT 2017 | davef
If you want in, 5-21h Bottom Termination Components (BTC) Task Group is in "Working Draft" revision from "A" to "B" of IPC-7093 - Design and Assembly Process Implementation for Bottom Termination SMT Components
Electronics Forum | Wed Jan 17 08:41:07 EST 2024 | spoiltforchoice
The neat and simple solution is indeed a laser. However I have seen other quirky ways to denote a build revision. These include a resistor with a value marking that matches the build revision e.g a 1K marked 102 could indicate assembly 1.02. Another
Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Tue Jun 29 14:33:49 EDT 2004 | fmonette
This is an active item of discussion for the upcoming revision of J-STD-033. Most likely the bake table 4-1 will be modified to include guidelines for level 2 components. Francois Monette Cogiscan Inc.
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Fri Aug 17 14:28:27 EDT 2001 | Chuck N.
I like the idea that files are stored on a Lan system. Typically lans are backed up daily or weekly by the IT department. If not they should be backed up on tape or disk weekly, monthly, etc. depending on how often new programs are released. The m
Electronics Forum | Thu Apr 25 09:34:24 EDT 2002 | fmonette
Michael, By the way, the default bake duration should be 48 hours at 125C instead of 24 hours. The shorter duration was based on a standard that is now obsolete. The current revision of J-STD-033 includes a variable duration bake table, based on co
