Electronics Forum: component screening (Page 1 of 37)

Removal of screening cans

Electronics Forum | Wed May 23 02:45:37 EDT 2001 | johnluckham

I am looking for a way of removing screening cans from a PCB without reflowing the components siyuated under the can. I remember HP use to make a laser that could be used for this job, had anyone got, or had experience of this problem.

Removal of screening cans

Electronics Forum | Thu May 31 17:14:06 EDT 2001 | davef

Look at "Circuits Assembly" June 2001, p 26 for an article on the very topic to which you refer. No experience here. If we don't want to reflow components in the 'can', we cut the can. Time consuming and crude, YES.

Re: screening adhesives

Electronics Forum | Sat Aug 28 14:23:52 EDT 1999 | JohnW

| Hi There, | | Could anyone please give me some pointers on screen printing non-conductive adhesives or where I could find the information avaliable. Aspects such as printing parameters, ideal stencil design and a general overview. Do already have

Placement component

Electronics Forum | Fri Apr 25 11:15:48 EDT 2014 | hegemon

We provide similar maps for our teams as well. For this exercise, Frazz has it. Screen print and use Windows Paint with the spray can tool to make dots. I do it often enough to have gotten very quick at it. Or get a copy of the software used to c

pb free component leads

Electronics Forum | Wed Feb 16 12:34:49 EST 2005 | greg

Hi all We recently have a problem with component in package 0805 (capasitor 100nF). I have noticed that after reflow soldering only one lead of the component is soldered. The second one is just laying on the PCB land. We use screen printing process

Epoxy on bottom of SMT component

Electronics Forum | Fri Nov 30 08:53:17 EST 2007 | jaimebc

Shy, Our 5 and 6 mils stencils have home plate apertures and reduced by 10% and using SMT adhesive. Never had a problem with components non wetting like you have. I do believe that you are not screening enough paste, something about the dog bone ape

Epoxy on bottom of SMT component

Electronics Forum | Sat Dec 01 22:25:32 EST 2007 | molos21

Shy You should try SMT-5. First solder PTH comps, then apply paste with your pick and place and apply glue with ur screen printer and come back to place smd with pick and place and then reflow. You will get great results. Good luck

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 15:08:56 EST 2007 | jaimebc

Shy, You mentioned that you are using "dog bone" apertures for your chip components? It doesn't make sense to me. I thought that the "dog bone" was used for fine pitch devices, to keep the solder away from the center and avoid bridging. It doesn't

Re: How to do with tombstoning for component '0402'

Electronics Forum | Thu Nov 02 17:15:34 EST 2000 | Erdem Bilaloglu

We are using semi-circular land pattern and 0.004" smaller appertures on screen. With stable rising slope (max:2.6degC/sec)we have not experienced any tombstonning so far.

Lead free component VS vision on Mydata M12

Electronics Forum | Tue Nov 22 10:46:46 EST 2005 | A Total Green Planet Solution

Try using a contrast filter. This seems to help. Also on the camera it self there is a white level control. Adjusting this may help. The bad thing is it may affect all your other profiles. Some times an easy fix is to have a screen print mark close t

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