Electronics Forum | Mon Nov 15 02:45:15 EST 2010 | 89jeong
Hello. We encountered a SMD problem on PCB. It is that the lead of photocoupler is shifted after reflow and don't meet the minimum requirement of side joint length. I know this is a defect but what i want to hear the reason and the solution to prev
Electronics Forum | Fri Aug 23 02:29:16 EDT 2019 | sssamw
It seems because the soldering area is not enough, so the wetting force is small to hold the switch, remember >0.08g/mm2 for each part as in IPC standard. So, anyway, you need increase the soldering area to reduce weight/area number to below 0.08g
Electronics Forum | Thu Oct 24 03:03:13 EDT 2002 | harriss
Hi: The component height will increase on the PCB after reflow soldering. But i don't know the accurate data of the increased height. Who can help me to get it? The stencil thickness is 5 mil we used. Thanks Harriss
Electronics Forum | Thu Oct 24 13:32:03 EDT 2002 | russ
There are many factors that will affect post soldering height. Lead shape/type, pad geometry, fillet formation, etc... You will need to measure each type of component before and after reflow. Russ
Electronics Forum | Mon Jul 31 07:37:57 EDT 2023 | tommy_magyar
Hi Simon, Yes, red glue should help, assuming that it is being dispensed by a glue dispenser. For stencil printing I used yellow glue in the past (can't remember the brand). Your pick and place machine should be able to achieve on it's own 35 um
Electronics Forum | Mon Jul 31 18:41:07 EDT 2023 | emeto
Chip-bonder glue(Loctite 3612 for example) will harden at lower temperature way before paste goes to liquidus stage, so it will hold the part in place.
Electronics Forum | Tue Aug 01 06:24:31 EDT 2023 | simonr
@srikant I'll check their process, meanwhile thanks for the reminder to put fiducials nearby. @MagyarT and Evtimov it sounds like it should work OK, the machine specs are 35um (3 sigma) so the results will be interesting, will post when I get some d
Electronics Forum | Tue Aug 01 08:19:10 EDT 2023 | shrikant_borkar
you are welcome, don't forget to set the search window (Fiducial Mark if 1D. then the search Window is set to 3D). Please reply once you have done.
Electronics Forum | Fri Jul 28 11:12:18 EDT 2023 | shrikant_borkar
Hi SimionR, Is Glue Process Dispencing or Glue Printing thru Stencil? if Its Dispencing Glue thru a Nozzle then its a controllable process. I have performed it thru HDP-3 Panasonic. Placement of Glue either one DOT or Process must be aligned with th
Electronics Forum | Thu May 05 01:21:42 EDT 2011 | city4497s
Hi Davef The problem shows up on * random location including component pads * all PCB and different PCB supplier * different solder paste lot * both printing and dispensing process * all production shift * we have only 1 production line It black,
