Electronics Forum | Fri Nov 14 17:15:54 EST 2014 | tombstonesmt
Are you experiencing the solder balls on the opposite side of connector insertion or same side? If it's the same side as connector insertion how many strokes are you using at? We've experienced a few issues with pin in paste, everything points back
Electronics Forum | Sat Nov 15 05:08:45 EST 2014 | grimus
Same side (component side) if You give me e-mail I can provide You more pictures. I'm making one stroke with same speed (I'm using closed proflow head and DEK printer). 5 mils thickness stencil. Products requirement - 3 IPC Class (75 % and more fill
Electronics Forum | Mon Nov 17 14:42:02 EST 2014 | tombstonesmt
Sounds like your snap off profile needs adjustment. More than likely there is paste under the stencil being transferred over to the board. Try adding a cleaning cycle after every board to determine if this is the issue. If the solder balls go away af
Electronics Forum | Thu Nov 13 12:32:12 EST 2014 | jorge_quijano
Hola, I've used the free e-book that I'm attaching when I implement the first Pin in Paste process, it was helpful. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=17555&mc=10 One thing that was helpful was also th
Electronics Forum | Wed Nov 19 10:47:37 EST 2014 | grahamcooper22
Probably not all the overpinted paste is flowing onto the joint. You may need a paste with great coalescence properties so it all flows together, and doesn't leave any on the resist. Does the paste drip out the through hole too ? If so it suggests it
Electronics Forum | Thu Nov 13 10:05:18 EST 2014 | grimus
Hello, I'm fighting with problems of random solder balls that appears after reflow soldering around Pin in Paste component. I'm mounting this component with Pick and Place machine. I'm using solder paste type-3 and this is lead free product. This is
Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus
Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering
Electronics Forum | Wed Jul 17 11:57:38 EDT 2013 | proceng1
Everything in 7.4 shows the clinch and fillet on the other side, assuming the body is mounted on the Component side. In my case, the fillet will be on the body side.
Electronics Forum | Wed Jul 17 09:40:33 EDT 2013 | proceng1
I have a CM project that is a single sided pcb (not plated thru holes) and I have 3 axial resistors that the Customer wants placed on the "solder side" of the board. I cannot find an IPC-A-610 reference to putting parts on the wrong side of a single
Electronics Forum | Wed Jul 17 10:22:15 EDT 2013 | rgduval
Sure. Section 7.4 covers unsupported holes, and defines the usual standards. Clinching, fillet on the plated side, lead protrusion, etc. Cheers, ..rob
