Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef
Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-
Electronics Forum | Mon Jun 05 14:37:55 EDT 2017 | stevezeva
At a past employer we stacked caps and resistors quite regularly. As some have suggested a dispensable paste was used and dispensed by hand and then the stack was placed. At first it was placed by hand, but then we were able to program our Mydata to
Electronics Forum | Fri Nov 12 10:36:33 EST 1999 | Dave F
Wolfgang: Sure, stacking chip components is common practice in prototyping, as you say, but it's not good practice for production work. Documentation: * ANSI-IPC-275 does not allow stacking * MIL-STD-2000A does not allow stacking * J-STD-001B is u
Electronics Forum | Tue May 02 16:37:16 EDT 2017 | travishemen
Our customer wanted us to stack two chips but I convinced them to let us place them side by side on the same pads. It had the same effect. They were 0603 size components and the pads were big enough that they still passed IPC for solder quality. I
Electronics Forum | Fri Jun 02 15:44:42 EDT 2017 | mrk
Thanks DeanM. Are you adding the additional flux to the paste that you are dispensing, or are you ordering it separate from what you normally screen?
Electronics Forum | Tue May 02 15:25:22 EDT 2017 | mrk
Hi, We have recently been tasked with producing a PCB assembly that requires a chip resistor to be stacked on top of a chip capacitor (both are 0603 package size). This becoming a more common practice, I was wondering if anyone has been successful i
Electronics Forum | Sun Nov 14 11:45:08 EST 1999 | Jeff Ferry
Back to Wolfgang's original request. Stacking chip components is just one of many unusual mods that are being added to IPC 7711 Rework of Electronic Assemblies. While some may deem this technique unacceptable, it is a relatively common practices
Electronics Forum | Mon Jun 05 10:42:28 EDT 2017 | philc
I guess it all depends on volume. If you are talking thousands of PCB's, then automation is best, if possible. Otherwise, hand-soldering them post-production is the obvious solution. How about bill-boarding them? That way, they would fit on the land
Electronics Forum | Mon Jun 05 12:30:24 EDT 2017 | deanm
Mike, The dispensable solder paste is ordered separately from the printed paste because it has a higher flux content. I would not feel comfortable mixing liquid flux into the printable paste. Ask your paste vendor if they have a dispensable version.
Electronics Forum | Wed May 03 02:23:11 EDT 2017 | Rob
Many years ago (20+) we did this by preassembling the 2 parts into a mini leadframe with high temp solder paste, which was a pain but then they could be dropped in trays, surface mounted and hit the line clean. I'm guessing you have a low value cap
