Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Mon Aug 08 16:14:36 EDT 2011 | wmburke
We are building a plasma diagnostic to monitor MHD phenomena in tokamak. As part of the development, we need high-voltage, high-power RF capacitors to tune and match an inductive load. This application is similar to a small induction heater, with t
Electronics Forum | Tue Apr 14 15:42:45 EDT 1998 | Scott Cook
| Scott, | I am not really in a position to answer this as fully as I would like because most military work with which I am familiar is subject to some degree of secrecy most especially on the internet. At least we have signed up to such restrictions
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Fri Mar 04 18:28:21 EST 2011 | hegemon
First, I would inspect for lack of solder bridges from the center slug to the outside leads. I would then look for evidence that the solder paste has reflowed beneath the component, without leaving too much void percentage. Typically we allow up
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