Electronics Forum | Fri Jul 15 06:20:34 EDT 2005 | skandaae@vsnl.net
PLEASE SUGGST ME FOR A PROBLEM CAUSED DURING MY PROCESS In one of the product I am faceing one component tilt after tht reflow oven 1. check the thkickness of the paste found the paste was more reduse the thickness by adujesting the screenprintg s
Electronics Forum | Thu Jun 12 00:32:23 EDT 2003 | Henry
I would like to ask a question about SMT reflow process. I did 10 pcs samples but all is fail. The sample is double faces to have components (up-side has 4 pcs of BGA and down-side has 3 BGA and 2 QFP). And I saw some of BGA which is tilting in the P
Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
Electronics Forum | Wed Mar 27 19:40:03 EST 2002 | davef
Touch!!! Unwise. Stop. Do not restart.
Electronics Forum | Wed Mar 27 19:47:41 EST 2002 | ianchan
Huh? wats'ta mean??? "stop"???
Electronics Forum | Sun Mar 31 22:46:23 EST 2002 | ianchan
Ooooohhh...K..... roger that, over.
Electronics Forum | Thu Jun 12 03:34:23 EDT 2003 | sanjeevc
I would like to ask a question about SMT reflow > process. I did 10 pcs samples but all is fail. > The sample is double faces to have components > (up-side has 4 pcs of BGA and down-side has 3 BGA > and 2 QFP). And I saw some of BGA which is > t
Electronics Forum | Sat Feb 17 14:21:54 EST 2007 | Muhammad Haris
Hi All, I am using YV100Xg YAMAHA Pick and Place Mounter Machine and I am facing a tilting problem of PLCC 84 and QFP 240 pins ICs. I deeply checked about their vision files and place them on the double sided tape and found them ACCURATE on their pad
Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan
Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted
Electronics Forum | Wed Mar 27 17:14:10 EST 2002 | davef
It is certainly a process indicator. What is causing this condition? Is it a chip that has its toes over the edge, edging towards tombstoning? Contact: * Jack Crawford [ JackCrawford@IPC.ORG ] * Mel Parrish [ mparrish@SOLDERINGTECH.COM ]
