Electronics Forum | Fri Oct 08 16:48:24 EDT 1999 | Charles Morris
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Thu Oct 07 09:59:01 EDT 1999 | Dave F
| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement
Electronics Forum | Tue Mar 04 18:38:12 EST 2003 | ruggi
Most of what we do (across 800+ varieties) is bottom side first. In general, there really aren't any problems as long as our Customers follow the .25g/cm wetted lead perimeter spec for weight (which many don't), and don't mount tall components on th
Electronics Forum | Tue Nov 27 07:36:29 EST 2007 | shy
solder the part is for SMT component (located at top side and bottom side) and wave solder is for THP (located at top side only).
Electronics Forum | Tue Nov 27 06:11:42 EST 2007 | shy
Hi Loco, my PCBA got top side and bottom side and 90% SMT and 10% THP (top side) which need to be cover by wave solder. And that's why i need to go through reflow and wave.
Electronics Forum | Sun Dec 02 22:00:21 EST 2007 | shy
The idea for solder at bottom side is for component such as SOIC, QFP and chip. This solder is needed since not entire bottom component had glue. that's why we're combining both solder paste and glue and reflow at the same time.
Electronics Forum | Thu Nov 29 13:26:57 EST 2007 | realchunks
Nope, my thought process ejected from my brain and will have to watch this thread pan out from the side lines. Should be interesting.
Electronics Forum | Fri Nov 30 08:35:51 EST 2007 | stepheniii
We put glue on the bottom of the board that already has the topside SMT mounted. We populate the board. We put it through a cure profile. At this stage the topside components are soldered on. The bottom side components are glued on with NO solder on
Electronics Forum | Thu Nov 29 13:05:46 EST 2007 | stepheniii
I really hate to ask but must. Are the components that are falling off, the components that don't have glue? Seriously not all the parts on the bottom are glued on? How do they stay on during the wave? The normal way is to run the top SMT as normal
Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy
Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo
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