Electronics Forum | Sun Apr 25 08:06:47 EDT 2021 | pradeep14
Presently we are facing wrong loading of zener diode components in SMT Line. * In the particular product, we have two different part numbers of zener diode but the package and color code is same.Only the voltage is different is there in between two p
Electronics Forum | Mon Apr 26 18:45:32 EDT 2021 | rgduval
I've had the most success in a check/double-check set up. Most people will tell you that it's labor intensive, and they're not wrong. However, I suspect that those people have never had to manually change two components on a thousand boards at a sh
Electronics Forum | Thu Jul 30 16:50:41 EDT 2015 | lokit
In our production line we use the pick and placer My100 by Mycronics. We get a lot of feedback from quality department about IC's being placed upside down, wrong polarity. (Wrong polarity usually already delivered to us, or IC's placed in the sticks
Electronics Forum | Thu Jul 30 17:31:41 EDT 2015 | dyoungquist
We are running a Mydata (Micronic) MY15E. The MY100 is the next generation after the MYxxE series. As far as I know, there is no way for the machine itself to check the polarity of ICs to see if 1 or more are in the tube or reel different from all
Electronics Forum | Wed Aug 05 09:41:50 EDT 2015 | kmots15
For upside down and rotated parts try using the index mark (F6) in the package database for that component, at least then the machine should look for a unique feature on the bottom and if it cannot find it the part will be rejected. For the index ma
Electronics Forum | Thu Dec 19 11:30:11 EST 2002 | russ
What temp. are you planning on baking them? If this is long term process I would recommend that you hav trays made out of an appropriate ESDS material that can withstand your bake temp (such as duropol)for your QFPs. You can have several patterns/pa
Electronics Forum | Mon Feb 21 08:39:10 EST 2005 | pemnut
There are so many variables to this. It could be paste, pad size, contaminated components-pads, placement speed, component thickness being wrong in the program, dropping parts into the paste instead of placing them, component recognition ploblems. Is
Electronics Forum | Tue Jan 09 22:33:45 EST 2007 | Guest
Dear AJ, Try removing shield ,test it, verify if it would perform as the previous runs . If not, there maybe something wrong with device or as one of our collegue mentioned that there is possibilty the your customer change some components.If the
Electronics Forum | Wed May 17 12:22:54 EDT 2000 | JAX
Ramot, Without further explanation everyone here is just taking stabs at it..... Sounds normal, I'm game! Have you looked at board finish(HASL?)?? Measured paste height?? Are they always off in the same direction? If not, Handling?? What are the sp
Electronics Forum | Wed Jan 26 21:23:51 EST 2000 | Dennis
Hello! all Will anybody give me advice for missing componets for 0402, 0603 R or C chips? I am not gonna tell you which machine I use, but from my experience, every p&p machine has possibility for missing component after placing 400 or more componen
