Electronics Forum | Thu May 19 12:36:53 EDT 2005 | Brenda Robinson, SPHR
Hello. I am an HR Manager looking to benchmark pay rates for engineers in the Midwest with experience in reverse engineering and component level repair experience. The experience should be in BGA type repair with the core experience in setting the
Electronics Forum | Thu Aug 03 09:14:34 EDT 2006 | G
This software option called CLS (component level server) and could be used with or withoout splice detection system, which are existing for all S-type feeders
Electronics Forum | Wed Apr 25 10:59:15 EDT 2007 | slthomas
I don't know of any standards that apply to hardware at the component level. I would think, though, that unless the spec. sheet for the component specifies cracks there shouldn't be any.
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Thu Sep 23 10:11:15 EDT 1999 | Earl Moon
| Hi All, | | I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. | | | thanks | | I appreci
Electronics Forum | Mon Feb 06 17:19:59 EST 2017 | davef
Evtimov: IDEALS Project was one of the first to talk about componebt and board damage caused by LF soldering temperatures. There's lots of more current stuff on the web. Here's some that may help: * Assessment of Long-term Reliability in Lead-free As
Electronics Forum | Mon Nov 01 14:35:44 EST 2004 | pdeuel
I have a total of 3 of these types of cards that have malfunctions of various types that I need at least one fixed. Can anybody out there help? Can anybody offer support to troubbleshoot this problem or the problems with our other cards, to component
Electronics Forum | Thu May 19 12:38:38 EDT 2005 | Brenda Robinson, SPHR
Hello. I am an HR Manager looking to benchmark pay rates for engineers in the Midwest with experience in reverse engineering and component level repair experience. The experience should be in BGA type repair with the core experience in setting thermo
Electronics Forum | Tue Jul 19 14:29:12 EDT 2005 | ppwlee
What are possible failure analysis (destructive or non-destructive and what are the pro/cons) I could conduct on the component level (of an IC) to determine failure mode/root cause? We are measuring internal shorts between leads on a SOIC after sold
Electronics Forum | Mon Jul 09 11:59:25 EDT 2007 | sck1971
Does anyone have any industry standard yield factors to load at the component level to account for set up scrap and machine waste during production? I'm assuming there are different percentages used for each package size (0402, 0603, SOIC8, etc) but
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