Electronics Forum | Mon Apr 20 00:19:20 EDT 1998 | Marcos Silva
Ola Pelegrini, Trabalho em Sao Paulo, na Siemens. Sou respons�vel pela assistencia tecnica de maquinas insersoras SMD. Acredito que possa consultar nossa divisao de componentes - ICOTRON, a fim de consultar sobre este componente. Nosso telefone: 011-
Electronics Forum | Thu May 11 11:14:05 EDT 2000 | �ngelo Marques
Hi, Your solder land it`s OK? Send me the dimensions of the solder land and the capacitor n.� of componentes in the PCB and the dimension of the PCB for trying help you. Sory my bad English. �ngelo
Electronics Forum | Tue Jan 09 14:15:43 EST 2018 | tozitom
Hi SMTnet, I'm newbie here and searching for information on a pcb reconvertion. So in order to reduce costs on a small pcb+ componentes+assembly I need your experience on assembling only SMT components vs SMT+TH; the point is actually my PCB has abou
Electronics Forum | Thu Dec 21 19:24:25 EST 2000 | Alejandro Rodriguez Gallegos
Hi Sorry my poor english We have some problems with some componentes 0402 we recived by the manucterer oxide in the tape reells exactly in the bottom side to the reel I think the root cause is the oxide in the tapes rells What do you think? And ot
Electronics Forum | Fri Jul 11 15:47:54 EDT 2008 | hegemon
We used these same type of parameters regardless of the QFN package size. We used componentes that ranged from 3x3mm to 12x12mm Same idea. The reduction in solder paste for the center pad is the key. Too much, and you wind up with no connects at the
Electronics Forum | Thu Mar 20 12:04:42 EST 2003 | Ren� Sandoval
Hello Garcia: For my experience in Tombstone problems I recommend you to check the next points: -Use Solder paste with 2% silver -Use 5 mils Th Stencil -In some machines , for 0402 or smaller componentes , you require an special holder for the feed
Electronics Forum | Tue Sep 01 11:30:28 EDT 2009 | rgduval
Is the solder wetting to the pad, and not to the part? If so, and all other things being true (same process, profile, solder), we'd suspect some contamination on the part preventing solder from wetting to the part. This could be tested by attemptin
Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
Electronics Forum | Thu Dec 07 18:41:27 EST 2006 | GS
RoHS, or better Lead Free is an EU Directive that has been pushed ahead and driven by opportunistic lobbies ( equipment, materials, componentes,logistics, analysis labs, consultants, etc). Over here, in Eurolandia, since 2001 (the smartest started
Electronics Forum | Sat Feb 20 20:24:40 EST 2021 | sync40
Hello Ameen, It is needed a moderate impact bump to generate skew. Even blowing of the fans generally cannot generate serious skew -unless the pads apertures are not suitable for the components size/weight. You can try for yourself. Take a board wi
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