Electronics Forum | Thu Apr 20 22:14:51 EDT 2006 | raquel
hello! need ur inputs... if the Matte Sn pbfree finish of the component discolors AFTER having been exposed to bake, or, after reflow, will the base leadframe have any potential contribution to it? i know most likely suspects would be the plating pro
Electronics Forum | Wed Dec 17 14:38:25 EST 2003 | davef
Francois Monette [Cogiscan Inc. 450-534-2644 fmonette@cogiscan.com ] is the resident genius on component and board baking. If he doesn't chime-in a in a day or so, give him a shout. He seems to nap quite a bit. Alternately, if you search on his na
Electronics Forum | Wed Nov 08 17:01:17 EST 2000 | pallen
I know there must be a specification for this but I don't know what it is. What is the maximum psi setting for an air line that is used to dry assemblies off an aqueous cleaner? The assemblies are fixed but predominately SMT with many 0602/QFP/BGA co
Electronics Forum | Sun Jan 26 09:32:55 EST 2003 | davef
But soon after cleaning and drying with IPA, we find a white residue formation. A: IPA will not nothing to clean your board. The white residue is exactly what you should expect. Search the fine SMTnet Archives for background. >How do we avoid th
Electronics Forum | Fri Jun 09 09:52:03 EDT 2023 | tommy_magyar
I agree with Mainteneer on this. Depending on the active components, I would check the datasheets of them. Particular groups of components to pay attention to: microphones, microprocessors, transformers, relays, switches. Washing may be in some cases
Electronics Forum | Mon Oct 30 21:00:31 EST 2006 | hanocete
thanks for your inputs,but what i meant was that a connector component beside the BGA for repair has some flux residue on its leads after baking, the BGA was Ok. we are wondering why this happened...pls enlightened us.
Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt
You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl
Electronics Forum | Thu May 05 12:31:27 EDT 2005 | russ
Not in this case, these BGAs were lead free and the profile used was for a lead part. I guess I will give you the whole story. These boards were sent to us from a customer to have the BGAs replaced for an unknown to us reason. We removed the parts
Electronics Forum | Sat Jun 25 09:26:43 EDT 2005 | mskler
What is stencil thickness & what is the pitch of your component.What is your cleaning processor for stencil.
Electronics Forum | Mon Jan 15 11:43:13 EST 2007 | fredericksr
celsius or fahrenheit? I am not entirely familiar with the deeper details of HASL, but 130F-140F is adequate to clean many of the water-soluble fluxes used for component soldering.
