Electronics Forum | Tue Jul 30 08:38:55 EDT 2002 | dasal
Truthfully, there are pro's and con's for both technologies. (put cost of ownership aside for one moment) Nitrogen won't dry humidified components as rapidly as a desiccant dry box. I'm talking about a self regenerating dry box that uses molecular s
Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj
Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m
Electronics Forum | Tue Aug 06 08:54:21 EDT 2002 | mike
I have two basic questions: 1. We have a number of small convection ovens and want to modify some of these for baking out parts when needed. We have tried pumping nitrogen into these but I still run between 35 and 50 RH. Has anyone tried converting a
Electronics Forum | Mon Jul 29 21:41:22 EDT 2002 | davef
Rite. Moisture, not N2, in the air is the issue.
Electronics Forum | Mon Aug 14 14:27:56 EDT 2017 | emeto
God I hate the formatting of my post!
Electronics Forum | Thu Aug 17 12:59:36 EDT 2017 | horchak
There is DFM Design for Manufacturing, but now I see DFF Design for Failure. Start over.
Electronics Forum | Sat Aug 12 02:52:16 EDT 2017 | tsvetan
There is no solution in above case, this is caused by the PCB design. There are no thermals on the pads connected to the copper poured area. So the other pad reflow first and lift the component.
Electronics Forum | Fri Aug 11 22:50:57 EDT 2017 | heros_electronics
Anyone who knows how to prevent such flaw? Tombstones are those lifted components from one sides. This results in costly and time-consuming amounts of touch-up and re-work after the assembly is completed. For the customers, this extra work translate
Electronics Forum | Mon Aug 14 03:25:51 EDT 2017 | spoiltforchoice
There is no solution in above case, this is > caused by the PCB design. There are no > thermals on the pads connected to the copper > poured area. So the other pad reflow first and > lift the component. Yes, this. You could try playing with
Electronics Forum | Thu Aug 17 12:18:40 EDT 2017 | cyber_wolf
I do not see anything obvious that would cause a thermal mis match. Regarding reflow profiles reducing tombstoning, Unless there is something wrong with your paste or you are running smaller than 0402's, I have NEVER seen a reflow profile reduce tom
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