Electronics Forum | Fri Jun 23 10:00:08 EDT 2000 | Chrys Shea
Yeah, them soldering machines sure got some demons in them...My waves used to get blamed for wrong polarities all the time. Sneaky little devils used to pull components out of the boards, flip them around, and get the pins back in the holes while
Electronics Forum | Thu Sep 10 17:10:00 EDT 1998 | Steve Gregory
Hi Tim, 8-mil huh? Boy, that's getting down there...you know, placing 8-mil is one thing, but printing solder paste on 8-mil pitch is another. Most of the time when I've seen 8-mil pitch on a board it's been attached with hot-bar...but I guess
Electronics Forum | Thu Sep 03 12:40:11 EDT 1998 | Aselco electronics
We are writing to have information about the automatic mounting process of flip-chip. We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). Thanking you in a
Electronics Forum | Mon Aug 01 17:54:02 EDT 2005 | Stefan
If you are using vib. feeders than the component may be flipped length wise by the following components. Components should be landing with the leads on the right side but upside down. If you are using tape feeders the component may be flipped sideway
Electronics Forum | Fri Sep 04 09:39:54 EDT 1998 | jim foley
:I believe it can be easily done using the universal GSM platform. You may want to contact Universal instruments corp. in Binghamton NY for further information. We are writing to have information about the automatic mounting process of flip-chip.
Electronics Forum | Sat Sep 05 08:55:57 EDT 1998 | Dave F
| We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking yo
Electronics Forum | Tue Jun 10 15:47:18 EDT 2014 | hegemon
Possibly the components have been re-taped in that particular reel, with only electrical function in mind? Hard to see a nozzle causing a flip, and I am thinking if your feeders are vibrating bad enough to flip the components in the tape, that you
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
Electronics Forum | Thu Jul 28 08:02:09 EDT 2005 | stepheniii
Check the pick postion in the feeder. If the nozzle is picking at the edge of the component, it could flip it. BTW what kind of machine are you using? Stephen Olan
Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley
| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere
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