Electronics Forum: components lifting (Page 1 of 19)

BGA pads lifting from PCB

Electronics Forum | Tue Jul 07 05:55:34 EDT 2009 | kpm135

I agree with your assessment of the two pins with irregular solder. The head-in-pillow or broken joint are both probable events for your defect. At this point in the process it will probably be difficult to pinpoint the exact cause. If it was a broke

Skewed and popped components

Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt

Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.

Tombstone components issue after reflow?

Electronics Forum | Sat Aug 12 02:52:16 EDT 2017 | tsvetan

There is no solution in above case, this is caused by the PCB design. There are no thermals on the pads connected to the copper poured area. So the other pad reflow first and lift the component.

Tombstone components issue after reflow?

Electronics Forum | Fri Aug 11 22:50:57 EDT 2017 | heros_electronics

Anyone who knows how to prevent such flaw? Tombstones are those lifted components from one sides. This results in costly and time-consuming amounts of touch-up and re-work after the assembly is completed. For the customers, this extra work translate

Tombstone components issue after reflow?

Electronics Forum | Mon Aug 14 03:25:51 EDT 2017 | spoiltforchoice

There is no solution in above case, this is > caused by the PCB design. There are no > thermals on the pads connected to the copper > poured area. So the other pad reflow first and > lift the component. Yes, this. You could try playing with

Tombstone components issue after reflow?

Electronics Forum | Sun Aug 13 22:26:01 EDT 2017 | dawson

Anyone who knows how to prevent such > flaw? > > Tombstones are those lifted components > from one sides. This results in costly and > time-consuming amounts of touch-up and re-work > after the assembly is completed. For the > customers, this e

Mydata Hydra and 0201 components

Electronics Forum | Fri Sep 02 07:38:13 EDT 2005 | DannyJ

Hi Mike, I haven't tried the 0201s with a Hyrda, but after seeing 20 reviews of your message without a response, I'll try and share my experience with 0402s on a non-Hydra machine. The 0402s are slow, but I managed to get some speed by maxing out

Adhesion of conformal coating to plastic components

Electronics Forum | Tue Jun 02 14:32:58 EDT 1998 | Chris Fontaine

We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not alwa

Re: Adhesion of conformal coating to plastic components

Electronics Forum | Wed Jun 03 15:22:12 EDT 1998 | Greg Curler

| | We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not

Re: Adhesion of conformal coating to plastic components

Electronics Forum | Tue Jun 02 15:53:32 EDT 1998 | Earl Moon

| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al

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