Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron
Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad
Electronics Forum | Mon Apr 26 09:18:15 EDT 2010 | sudhir14
Hi, friends Need your urgent help on bellow issue ....... we are facing issue of misalign of one bulky SMT transformer during the placement itself rejection @40% & after reflow rejection @5 % using SMT m/c QP242 , placing this component at end of al
Electronics Forum | Mon Dec 06 17:50:39 EST 1999 | Kantesh Doss
Christopher: Thank you for sharing your experience about the DPAK. Yes, out part has a heat sink at the bottom. Our stencil opening was 7 mils (in both X and Y) smaller than the pad size excepting that the stencil opening consisted of a series of zeb
Electronics Forum | Sat May 08 07:03:31 EDT 2010 | aj
From looking at your images I would say it could be poor solderability on the terminations of the component itself. Can you get your hands on a different date code and try them out?
Electronics Forum | Fri Apr 30 00:20:33 EDT 2010 | sudhir14
We are using QP fuzi m/c during the placement of comp. PCB is fixed & placement head is movable This component is placed at last but still we are getting the problem Comp. is placed with slowest setting also slowest comp. transfer speed of nozzle h
Electronics Forum | Thu Dec 02 23:43:23 EST 1999 | Kantesh Doss
We have a serious misalignment problem of D-Pak components (Specifically Motorola's part number MJD-3055/MJD-2955)following reflow soldering process. We are using Alpha Metals UP78 solder paste. Our reflow oven is Nitrogen inerted and our oxygen leve
Electronics Forum | Sun May 02 11:36:27 EDT 2010 | jdeluna
I do agree with Jerry: you should apply more paste on it, either with a step stencil, or doing overprint on it by, let's say 120% on Transformer's pad. Also, you need to check : a) there's smooth movement on transport process after the placement, no
Electronics Forum | Tue May 07 07:55:33 EDT 2002 | Sir Alexandr
Our SMTproduction has next troubles : 1. irregular 0603-components in tapes (different solder shapes) makes vision errors on placement devices 2. big solder amounts makes pickup and placing errors 3. some tapes delivery delays , so production halts f
Electronics Forum | Thu May 09 17:07:56 EDT 2002 | davef
Troubles, troubles, troubles. If it weren�t for bad luck, I wouldn't no luck at all, eh? Tough business. Comments on your trouble are: * On machine vision errors from less than ideal capacitors: This is life. Reprogram your machine to either wid
Electronics Forum | Fri Mar 09 08:25:13 EST 2001 | CAL
We have seen some problems with component end cap solder terminations not being symetrical. i.e. If one end on the cap has a larger solder ternination this sometimes is enough surface area during reflow to lift the opposite side of the component. We
