Electronics Forum | Fri Apr 20 09:52:25 EDT 2018 | ushir
Hey everyone, Ive recently discovered a problem where components picked are moving on a nozzle during the vision scan. Pick and Place being used is an iPulse M7-3L. When the scan camera scans across the components, the components are shifting on the
Electronics Forum | Fri Apr 20 13:04:51 EDT 2018 | dleeper
Have you tried using a larger nozzle? If the selected nozzle is too small, it won't provide enough force to hold the part in place. What kind of part are you having trouble with?
Electronics Forum | Fri Apr 20 13:25:46 EDT 2018 | emeto
This one should be easy. 1. Check your nozzle - make sure you use the right nozzle and the nozzle tip is not damaged in any way. 2. Vacuum suction going to the nozzle should be measured/checked.
Electronics Forum | Fri Apr 20 21:16:29 EDT 2018 | sarason
And if it is a hard rubber nozzle for a large IC make sure it is still pliable. And solder paste isn't stuck up the end of your nozzle sarason
Electronics Forum | Wed Aug 07 05:26:45 EDT 2024 | dimamalin
We are working with ASM SX machines. To solve similar issues, it is necessary to check the PCB thickness in addition to the component height. Reduce the placement speed. Check the possibility of correcting the placement profile for the component. If
Electronics Forum | Thu Aug 22 06:55:36 EDT 2024 | SMTA-69549243
I would also consider the smount of solder paste. If it can be increased, there might be better adhesion of the component between assembly and reflow.
Electronics Forum | Tue Aug 06 19:22:15 EDT 2024 | jdengler
Poly, I don't know the UIC GX11 but on other machines I would first look at component height in the program. If it is not in the paste you may have the part height set too high which means you are dropping it onto the past not pushing it into the p
Electronics Forum | Thu Jul 03 17:22:03 EDT 2008 | mikesewell
On an ACE KISS machine we could program a drop in Z height to give a peel off angle after the component was soldered. Usually not necessary as the solder at the nozzle is falling away from the lead down the nozzle. If possible, we would program a fr
Electronics Forum | Tue Apr 24 13:48:37 EDT 2001 | CAL
I would look at the pad to part ratio.Over sized pad geometry will give the component more room to move. I have also seen where the two pads that make up chip components are not symetrical nor complimentary.The pads should be equal in the X or Y dire
Electronics Forum | Tue Mar 06 15:59:33 EST 2007 | pima
hello I would like to ask you for advise. I have problem with one of my SMT line and skewed parts at the end of line after reflow. My line is composed: DEK, 3d visual inspection of paste printing, IP3, 8 zones reflow oven. I m builidng there produc
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