Electronics Forum | Mon Mar 24 12:11:38 EDT 2008 | scombs
Is this what you are looking for? We do this on quite a few boards and it has eliminated component problems from the Cab depaneler (pizza cutter)
Electronics Forum | Thu Mar 20 17:39:41 EDT 2008 | boardhouse
FSW, Another suggestions is if you have rail on your product and you are concerned about stress fracturing certain components you could add a routed slot to add relief in that area. So when you snap the rail off their would be no stress in that area
Electronics Forum | Tue Jun 23 11:08:42 EDT 1998 | Russ Miculich
| Any ideas on what to buy? Only need to build surface mount protos, ability to rework. Is a rework station okay? | Will subcontract production after design is proven. Best bet is to get an Elite or OK Industries manual printer if you are not doing
Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann
I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.
Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann
I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.
Electronics Forum | Wed Apr 25 07:57:36 EDT 2001 | wbu
Steve: Try to find something that�s common to all your skewed parts. We haven�t had much trouble with it except for some MELF diodes a couple of years ago which didn�t look well aligned but made no trouble with specs. Better suited pad design solved
Electronics Forum | Mon Aug 20 10:03:48 EDT 2007 | slthomas
Wow. Never have, never would, but that doesn't mean it couldn't be done. Mostly it just seems impossible to design a carrier clip that could hold both well...more likely it would hold one well and the other poorly, or both poorly. Anyway, is there
Electronics Forum | Tue Feb 20 04:18:39 EST 2001 | chinaman
Hi everyone if once the exposure time is exceeded the only option is to bake the components. I learned there is an "old spec" for the baking conditions (24h/125C or 192h/40C) and a "new spec" which is the current standard specifying conditions of 4
Electronics Forum | Sun Mar 15 14:10:26 EST 1998 | baruch schiffmann
we are looking for paste printing specs.& stencils holes shapes to perform soldering reliability d.o.e. of the a.m. subject. looking forward to your info. tech. dept. /telrad prod.
Electronics Forum | Wed Mar 31 09:05:36 EST 2004 | russ
That would be one BIG spreadsheet, there are a lot of mfg with a lot of components for each one. As you know when going to the datasheetlocator you notice the huge listing of suppliers (500+) each one of them probbaly has anywhere from 1 type of co
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