Electronics Forum | Wed Apr 25 16:35:55 EDT 2001 | Steve
Most of the time, we have very few skewed parts so I feel comfortable about the processes in general. However once in a while, often enough to throw off the first pass yield, we will get a few boards with a lot of skewed parts. By skewed I mean that
Electronics Forum | Thu Jul 20 02:49:13 EDT 2006 | reypal
Is there any industry standard to what acceptable (%) level the throw-out component during placement.regardless, program-vison, feeder, nozzle,component problem? Thanks in advance!
Electronics Forum | Wed Sep 23 04:15:44 EDT 2020 | pkmkabigon
Hi all, I have a concern about how to prevent the component from bouncing out of the carrier (embossed pocket). I don't know what the reasons for this problem. Can anyone help me explain and show me the solutions to fix. Tks
Electronics Forum | Wed Sep 23 09:21:53 EDT 2020 | dimamalin
first of all checking feeders
Electronics Forum | Wed Sep 23 13:44:57 EDT 2020 | emeto
Hello SMT bear, 1. Is the embossed tape the correct tape for the component? Sometimes packaging services might use wrong tape if part was sent for tape and reel. CAn you tell us what package the component is? What tape is it packaged in? 2. Feeders
Electronics Forum | Thu Jul 20 23:44:41 EDT 2006 | reypal
Thanks Darby for your comment and absolutely agree with you. What we are trying to define here is a KPI for throw out. but before that, we need to get a guideline or standard as reference. in this case, if no any industry standard then we can use cur
Electronics Forum | Thu Jul 20 19:51:40 EDT 2006 | darby
Are you trying to tie someone to an agreed wastage level or are you being tied? What machines are you talking about? What components are you talking about? The only acceptable wastage level is zero: but you can't get to zero until you've had some was
Electronics Forum | Thu Nov 03 02:16:55 EDT 2022 | spacecase
Hey I'm having an issue with a samsung 421f component placer. The machine is fine on the first 5 boards then on the 6th or so it just throws them wherever. The problem is the smallest flat components start sticking to the nozzle even after hitting th
Electronics Forum | Thu Feb 28 14:32:13 EST 2008 | cyber_wolf
Let me re-state the last part.... The throwing out part is paste dependent.
Electronics Forum | Thu Feb 28 14:27:07 EST 2008 | cyber_wolf
The flux dries out and the paste sticks in the stencil apertures. As the flux dries it also causes the solder to oxidize. Hahaha ! I remember adding flux to paste back in the day to loosen it up. Do not do it ! I have been told by reputable industry
