Electronics Forum | Wed Feb 08 07:52:21 EST 2006 | davef
'TAL' is a poor measure of solder connection heating. In a reflow process, what you need is about 5 seconds at liquidus for the specific solder plus: * 20*C when soldering to Cu. * 35*C when soldering to Ni. This time over temperature is measured
Electronics Forum | Thu Sep 13 17:57:59 EDT 2001 | davef
You're correct. It is curious. Possible angles to look at are: 1 WS609 loves moisture in the air. In high humidity shops, this paste hakes-on liquid. If this is the case, you should also see slumping, resulting in fine pitch bridging, and solder
Electronics Forum | Mon May 24 09:52:06 EDT 1999 | john thorup
| | | Has anyone had any experience or data using vibration during the reflow process. | | | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process
Electronics Forum | Thu Aug 25 20:00:31 EDT 2005 | Dave
Try Heller Industrie's website at http://www.hellerindustries.com They have a formula that they offer for free that calculates land pad geometry to component weight to prevent drop off of components during second reflow. If you can't find it, give t
Electronics Forum | Fri Aug 26 01:02:34 EDT 2005 | Vince
Hi Dave, as you said Heller has forum showing you how to calculate land pad for component dropped off during second side. Unfortunately I couldn't found it. would you please give me that link, instead of just http://www.hellerindustries.com. Thanks
Electronics Forum | Tue Aug 11 09:52:53 EDT 2015 | rgduval
I assume that these parts are falling off during second-side reflow? The easy solution, of course, is to not build high-mass components on first-side reflow. If this isn't practical, however, you can try using epoxy/glue under the component. We'
Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup
| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component
Electronics Forum | Tue Aug 11 09:48:22 EDT 2015 | samputrah
We have had two jobs that have the same issues with DPAK's sliding off their pads during reflow. We tried to resolve this by placing epoxy on the side of the component to create a "dam". However this is not repeatable enough to be a quality resolutio
Electronics Forum | Tue Apr 24 12:56:39 EDT 2001 | Steve
We are experiencing a fair amount of skewed components, mostly 0805 resistors and capacitors, during the reflow process. We have pretty much ruled out the pick-n-place and have determined that it may be happening because of variables at the paste scr
Electronics Forum | Mon May 10 18:05:31 EDT 2004 | daman
We are trying to solder a Surface mount relay having lead free finish on the leads. The leads are not getting soldered down during the reflow. The leads also look oxidized (failed our solderability test) but we don't have an option but to use these r
