Electronics Forum | Tue Feb 21 20:14:50 EST 2006 | Joseph
Dear all, Recently our lead-free samples being rejected due to very dull and sometimes grainy and very porous surface on solder joints. This samples was flow thru' the lead-free wave soldering with SN100C alloy composition. Referring IPC-A-610 D, le
Electronics Forum | Tue Mar 20 20:14:40 EST 2001 | davef
Electroplating [electrolytic] and dipping [HASL] are the two methods for applying solder coatings to features on boards. Disadvantages of electroplating lead / tin are: * "Weak knees" created at the edge of plated through holes. [I used to get weak k
Electronics Forum | Fri Jul 16 11:29:59 EDT 1999 | John Sims
We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. Thanks in advance, John Sims
Electronics Forum | Tue Jan 16 18:13:25 EST 2007 | greg york
Try to process the composite pallet through the wave without any flux and view volume of smoke and if any residue is deposited in the wave when it exits. My guess is that the pallets are releasing some binders that are high boiling and this in turn c
Electronics Forum | Tue Aug 22 11:03:45 EDT 2000 | Dr. Ning-Cheng Lee
Hi Kelvin, Regarding to the surface finish of the leads, Sn or Pd may be the direction that the industry takes. First of all, the answer must be "Pb-Free", limiting our choices. Sn has good solderability, and it won't have too great of an impact o
Electronics Forum | Thu Jul 22 02:58:25 EDT 1999 | George Verboven (Process Engineer)
| We are considering adding surface mount components to a board we currently produce. The board is made from CEM-1. Has anyone had any problems with surface mounting to this material? We use a glue/place/cure process. | | Thanks in advance, | |
Electronics Forum | Thu Aug 20 18:11:53 EDT 2009 | smt_guy
Hi davef, thanks again for that enlightenment. I'm just curious about what's happening with the solder joint of the said process. Again to add to my unending queries for now: So on top of that copper is a thin layer of lead-free solder composition
Electronics Forum | Tue Jan 05 19:25:50 EST 1999 | Earl Moon
| Jan 05, 1999 | | My question is: | Pls kindly advise what is the meant by a "Think Film hybrid design" and what are the advantages it would have on surface mount passive components e.g. capacitors and reisitors?? | | Thanks for your respond. | El
Electronics Forum | Tue Jul 31 18:46:40 EDT 2007 | rpadilla
Well, everyone has provided good advice, but if you are looking for a wave flux that can provide much better dwell times and consistent wetting throughout the hole fill, without making adjustments to your production process, I suggest going with Senj
Electronics Forum | Fri Jul 06 12:07:07 EDT 2001 | nwyatt
I have been researching lead-free paste for a while now and I will share with you what I can. Firstly, SnAgCu seems to be the common industry choice. It really depends on your application - the cell phone/pda sector is primarly using different comb
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