Electronics Forum | Sat Feb 25 16:17:46 EST 2006 | A.N.other
Hi, been researching archives for PCB composition. Nothing much for what I want. Can anyone direct me/advise of PCB composition, and I mean the full works. Content of base materials, solder resist, chemical compositions of epoxy etc. Much appreciat
Electronics Forum | Sun Feb 26 08:27:50 EST 2006 | davef
Start with: * Clark "Handbook of Printed Circuit Manufacturing * Coombs "Printed Circuits Handbook * Jawitz "Printed Circuits Board Materials Handbook
Electronics Forum | Sun Feb 26 13:43:18 EST 2006 | A.N.other
Hi, and thanks for your answer. Anything web based though? I find a lot of suppliers but not really answers that I need. Is it a secretive mix to manufacture PCB's? I've seen a lot of data sheets but not much in detail. I'm looking mainly for hazard
Electronics Forum | Mon Nov 19 05:49:44 EST 2001 | Cheng
The BGA solder ball composition is 62/36/2 Sn/Pb/Ag, does any problem exist for the solder joint reliability? And what is the difference on SMTA process between this and the normal 63/37 ball?
Electronics Forum | Mon Nov 19 10:06:15 EST 2001 | davef
Git otta taun!!! I never have heard of an Sn62 BGA solder ball. Several thoughts on Sn62: * Look at http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=4603&#Message17953& * Search the fine SMTnet Archives on � Sn62 �
Electronics Forum | Tue Aug 22 11:09:15 EDT 2000 | Eugene Smelik
Dr. Lee, Following up on this thread, I have read that a Pd-Ni lead finish is one promising option, but that Ni-oxidation might be problem. Can you explain this more? Thanks, Gene Smelik Cookson Performance Solutions
Electronics Forum | Tue Aug 22 09:30:31 EDT 2000 | Kelvin Chow
Mr. Lee, Although most of the lead free alloy used for solder paste and wave soldering have been identified, a suitable alloy used for leaded Ic packages (like QFP, PLCC..etc) have not been identified yet. Do you have any suggestion on this lead-f
Electronics Forum | Tue Aug 22 11:23:40 EDT 2000 | Dr. Ning-Cheng Lee
Plating houses seem to exhibit various results. Unacceptable Ni oxidation levels appear to be related to poor Pd plating processes. Ni oxidation can occur at 3 process stages: 1) prior to the Pd being applied (Ni already oxidized) 2) during the p
Electronics Forum | Tue Aug 22 11:03:45 EDT 2000 | Dr. Ning-Cheng Lee
Hi Kelvin, Regarding to the surface finish of the leads, Sn or Pd may be the direction that the industry takes. First of all, the answer must be "Pb-Free", limiting our choices. Sn has good solderability, and it won't have too great of an impact o
Electronics Forum | Mon Aug 25 02:57:43 EDT 2014 | arjunkolavara
We are in the process of qualifying our SMT lines for the High Melting Point Solder with alloy composition of 93.5 Pb 5 Sn 1.5 Ag.If any one has already an experience with this alloy,kindly do give ur inputs on the process of profiling . The reflow d
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