Electronics Forum | Thu Feb 09 09:36:55 EST 2006 | aj
All, I would like to find out if it is possible to adjust the cooling rate on a Conceptronic Reflow Oven Model HVN70. We do not use Nitrogen and the Cooloing system is Genesis GCM-1. From profiling it seems to be cooling too quickly. Any replies a
Electronics Forum | Thu Jul 21 06:14:28 EDT 2005 | aj
All, I have a Conceptronic HVN70 reflow oven with Genesis Cooling System. After profiling and checking the readings, the Cooling Rate seems to be very fast. Does anyone know if the cooling is adjustable? aj
Electronics Forum | Thu Jul 17 08:17:50 EDT 2008 | edmaya33
5 mil stencil.instead of round, use diamond aperture. RSS profile @ 215�C peak temp on balls(Sn/Pb), with a total of 3.5 minutes profile lenght.Ramp rate at 1.7�C/sec from ambient to 160�C. Consider also good cooling system on reflow. If rework proc
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
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