Electronics Forum | Fri Aug 03 09:58:20 EDT 2007 | stepheniii
And that's better because? I think the guy that thought this up has never been to a board shop or knows what is involved with plating. Why does he think it's the board shops that will disappear? Maybe they will simply build the board over the compon
Electronics Forum | Thu Apr 15 01:29:35 EDT 2004 | pyro747
Hello Everyone, I am having a pin chain speed problem. The speed of the chain will slow down after start up of the oven. Example if you set the conveyer to run at 41 in/min, as the oven warms up of conveyer will slow down phycally but won't chan
Electronics Forum | Tue Jul 30 08:38:55 EDT 2002 | dasal
Truthfully, there are pro's and con's for both technologies. (put cost of ownership aside for one moment) Nitrogen won't dry humidified components as rapidly as a desiccant dry box. I'm talking about a self regenerating dry box that uses molecular s
Electronics Forum | Fri Jul 09 11:39:27 EDT 2021 | stephendo
I was once part of a conference call with a component manufacturer. The call was starting to get heated as the manufacturer was certain that we were not storing the parts properly and we knew that we were. Then one of their people asked how many we
Electronics Forum | Wed Mar 12 10:34:42 EST 2003 | Stephen
I want to be clear. You are talking about buying fully populated cards? And not just bare boards. Approach different CM's and compare contracts. You can pretty much get anything from "build from kit" where all the CM does is assembly, to complete s
Electronics Forum | Sun Oct 10 17:40:50 EDT 1999 | JohnW
| | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | PCB is FR4 | | | Solder Mask is LPI | | | Reflow and W/S Profile = Standard
Electronics Forum | Sun Oct 10 18:53:04 EDT 1999 | Dreamsniper
| | | | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | | | | | PCB is FR4 | | | | Solder Mask is LPI | | | | Reflow and W/S Profile =
Electronics Forum | Wed Apr 28 17:27:31 EDT 1999 | Steve Gregory
Thank for the input. But I guess I was looking for more. We have been transferring boards for some time and a have good working relationship with our primary CEM and have worked out many bugs. I was thinking more on the order and don't shoot me bu
Electronics Forum | Sat Mar 06 13:34:04 EST 1999 | Earl Moon
| | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | Concerning the BGA stuff, I'm getting about 60% succes
Electronics Forum | Sun Mar 07 08:19:24 EST 1999 | Earl Moon
| | | | | | | | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | | | | | | | Concerning the BGA stuff, I'm getting
