Electronics Forum | Tue Apr 04 02:46:39 EDT 2000 | George Verboven
We are looking for a way to cure conductive adhesive. I heard about curing times from 2 hours and more. But I also received information that curing can be done in 10 minutes at 120 C. Of course it also depends from the type of glue. But the question
Electronics Forum | Wed Apr 05 22:42:28 EDT 2000 | Dave F
George: I would think so. We use an old Vitronics (822??) IR reflow oven to clue SMT adhesives. Gp get 'em!!! Dave F
Electronics Forum | Wed Feb 23 09:33:03 EST 2005 | rlackey
Hi, Does anyone have any experience of using electrically conductive adhesives, including info on the following? 1) Autodispensing/screen printing 2) Curing temps/profiles 3) Quality/conductivity of joint 4) Product recommendations Our customer w
Electronics Forum | Wed Feb 23 10:36:37 EST 2005 | Indy
Hi Rob, I had tried printig anisotropic conductive adhesive as a replacement for solder paste. Following were my finding. Adv: - curing temp is around 120-150C as compared to 217C (Pb-free) solder. - good electrical conductivity, since it is usual
Electronics Forum | Mon Feb 28 04:10:07 EST 2005 | Rob
Hi Dave, Was planning on skipping the paste step & screen printing the adhesive straight onto the pad, then placing the component into the glue & curing. (Board has LEDs only) Regarding the lead-free HASL issue - not entirely sure on the board man
Electronics Forum | Thu Feb 24 16:14:46 EST 2005 | davef
Rob: Why aren't the board houses over there going to lead-free HASL [not that HASL is the most wonderful thing on the planet]? What's the price delta on an unit basis for a x-HASL, now imm Ag board? Anyhow back to the point, so, you're proposing t
Electronics Forum | Wed Aug 19 06:40:06 EDT 1998 | G Thomas
Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. Must be resistant to solvents such as MEK and acetone. Cure below 150C, with possible potential for rework of the conections.
Electronics Forum | Thu Aug 20 09:19:19 EDT 1998 | JUSTIN MEDERNACH
| Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | Must be resistant to solvents such as MEK and acetone. | Cure below 150C, with possible potential for rework of the conections. MR. T
Electronics Forum | Sat Aug 22 16:07:31 EDT 1998 | Manuel Cornejo
| | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | Must be resistant to solvents such as MEK and acetone. | | Cure below 150C, with possible potential for rework of the conections.
Electronics Forum | Mon Aug 24 08:44:52 EDT 1998 | Justin Medernach
| | | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | | Must be resistant to solvents such as MEK and acetone. | | | Cure below 150C, with possible potential for rework of the conec
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