Electronics Forum: conductive containers (Page 4 of 5)

Soft Water Versus Deionized

Electronics Forum | Sat Jan 27 08:45:43 EST 2007 | davef

[clipped] Chemistry of Hard and Soft Water From Anne Marie Helmenstine, Ph.D., Your Guide to Chemistry. Water Works I'm sure you've heard the terms 'hard water' and 'soft water', but do you know what they mean? Is one type of water somehow better th

Re: Corrosiveness Measure

Electronics Forum | Fri Sep 04 09:51:34 EDT 1998 | Dave F

| | | | | | | | | We�ve been thinking again and need your help in sorting through an issue related to deionized (DI) water cleaning of assembled boards. | | | | | | | | | THE BACKGROUND: The water reclaiming systems goes: gross filter, fine filter,

Re: When using noclean flux or clean flux process?

Electronics Forum | Wed Sep 22 02:45:23 EDT 1999 | Brian

| | Dear All, | | | | In order to understand the soldering technologies in SMT, I'd like to understand why some cards are soldered and then cleaned, or only soldered whitout water cleaning nor "ultra sound" wavelength. | | | | I mean that I wonder

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Freshman in SMT industry needing advice

Electronics Forum | Wed Sep 22 14:45:01 EDT 2004 | Michelle Ogihara

As many people have participated in this email string, including competitors and customers of Sawa, I would like to respond to especially one rather detailed email expressing concerns with this stencil cleaning system. Also, this teaches me to keep

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

Re: Soldering to Gold

Electronics Forum | Sat Sep 18 04:42:52 EDT 1999 | Brian

Dave, I'll respond by paragraph: | | | Brian: | | I like Ag2 also. I prefer it over both 63/37 and 60/40, if the price is not a factor. Yes, gold rips through eutectic and near-eutectic solders like habanero slathered shiitake burritos through


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