Electronics Forum | Tue Jun 22 17:14:41 EDT 1999 | Dennis Fall
I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substrae)
Electronics Forum | Wed Jun 23 10:21:25 EDT 1999 | Chrys Shea
| I am looking to apply 10-15�m of a conductive material that will withstand 280�C. Our product consists of an alumina substrate sputtered with NiCr (2000�) and Copper (2000�) and 15-60 �m of electroplated copper (all metals patterned on the substra
Electronics Forum | Mon Sep 11 07:36:04 EDT 2023 | tommy_magyar
See attached snippet from a datasheet: Syringe 1. Twist and remove the cap from the syringe. Do not discard cap. 2. Measure 1 part by volume of A. 3. Measure 1 part by volume of B. 4. Dispense material on a mixing surface or container, and thoroughl
Electronics Forum | Mon Aug 21 20:31:49 EDT 2000 | Dave F
George: I�d like to help, but I�m sorry I�m not familiar with your Matthey adhesive, can�t find information about it on the web, and can not picture the problem you are describing. Please post a picture and give us more detail. At least give us a
Electronics Forum | Mon Feb 05 21:56:58 EST 2024 | davef
Generally for ESD testing, conductive materials (1.0 x 104 ohms to
Electronics Forum | Mon Oct 10 14:03:07 EDT 2011 | adp23
I have a few questions regarding Solder products being UL Listed or Recognized. I am aware that UL does test solder material (conductive material) using the UL 746 standard. However, i would like to know if UL actually recognizes the conductive mater
Electronics Forum | Wed Mar 04 17:19:29 EST 2015 | edwardt
Looking for any reliability data on aqueous flux residue causing low Z defects, specifically any data that may illustrate life expectancy under any humidity/temp environment. How long it takes for conductive material to migrate and form low Z impedan
Electronics Forum | Mon Dec 18 17:56:26 EST 2000 | Dave F
Does the thermal conductivity of a copper trace on a printed circuit board change as the copper oxidizes? Is the oxide on copper a thermal insulator? If so, should it be considered in an analysis of thermal resitivity between a ground plane and a h
Electronics Forum | Mon Feb 18 15:47:42 EST 2008 | ck_the_flip
In theory, no clean flux residues are electrically benign...period. Here's a good test. Subject the board to some moisture/humidity, and have your circuit designer ohm-out any areas that may be affected by conductive material. Option B: Have a la
Electronics Forum | Sat Jun 11 07:51:15 EDT 2016 | davef
Hi Steve ... There are arguments between fabricators and thermal relievers about adding non-connected copper tabs to barrels in hopes of providing thermal relief, but that's not what you're talking about, I believe. I don't foresee an issue moving t
