Electronics Forum: confirmed (Page 2 of 49)

BGA cracking

Electronics Forum | Mon Sep 15 06:14:49 EDT 2008 | milas

Hi Has anyone experienced laminateand BGA cracking on ENIG finish boards built using a lead free process? The laminate is cracked directly underneath the pad where the solder joint has cracked. We have confirmed the cracking via Microsectioning. We

DEK SMEMA to UIC Conveyor

Electronics Forum | Thu Jul 23 09:30:22 EDT 2009 | dekhead

It isn't clear if it was working and stopped, or if this is the first time you've tried to make it work. If this is first try, need to confirm cards and cables on DEK, and what interface is configured on UIC. I have SMEMA cards in stock if needed. P

Some ideas on Cracking in High Voltage Chip Caps

Electronics Forum | Tue May 26 18:17:22 EDT 1998 | Jerry

Our experience has been that mechanical crack occur vertically through the chip. In other words perpendicular to the board surface. You can sometimes tell through close inspection that the crack may have propogated from a point that the nozzle may

First piece inspection

Electronics Forum | Fri Jan 11 02:07:08 EST 2002 | ianchan

For repeated model runs, we go ahead with the SMT run, whilst the QA does the FA inspection. Limit FA timing to 2h or less...(simple boards yield faster time cycles). For new model runs, yep, we wait for QA to confirm the FA inspection, only with QA

Non-Rohs PCB

Electronics Forum | Mon Sep 11 03:52:14 EDT 2006 | aj

Hi All, this has not happened but I would like to know what the possible effects would be if we ran a non-rohs pcb (hasl) thru a leadfree Process. We have a customer who cannot confirm if the board is rohs compliant or not and we are waiting on con

ENIG or flash?

Electronics Forum | Mon Nov 27 08:10:08 EST 2006 | Loco

Dear all, I'm having a friendly discussion with our chief manufacturing engineer. To our PCB suppliers we specify the use of "chemical gold", imo this means we use ENIG, Our boards are all copper under the solderresist which imo further confirms we

RoHS PCB Questions

Electronics Forum | Mon Nov 19 17:40:38 EST 2007 | bbarton

No, the thicker plating and need for very high quality drilling and plating is DUE to the higher copper dissolution rate and higher contact time. As to the Sn100C material, their claims seem to confirm a "lower" copper dissolution rate, but so does A

software PPS v8.0

Electronics Forum | Tue Sep 14 00:35:47 EDT 2010 | sachu_70

The PPS helps to prepare a program off-line without affecting on-line production. However, there are certain efforts that we must consider, such as identifying the part orientation on feeder vis-a-vis its placement orienation on PCB, and confirming s

CP-642 sometimes does not finish power up sequence. It hangs.

Electronics Forum | Tue Apr 28 09:27:53 EDT 2020 | assuredtech

On power up, push and hold the F1 key during the complete boot up, this will force the machine to boot into it's I/O menu, this allows you to verify the conditions of all of the sensors and confirm if it is waiting on an input from a sensor. Most com

European logistics constraints

Electronics Forum | Tue Jul 25 11:04:03 EDT 2000 | rene

Lately I have noticed that many manufacturers of electronic (components) have problems in setting up their logistics structure in Europe (availability of parts, spares, reverse logistics, RMA shipments, leadtime constraints). Is there anyone who shar


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