Electronics Forum: connect (Page 9 of 174)

Re: Thermals on BGA vias to power plane

Electronics Forum | Tue Mar 24 13:21:16 EST 1998 | Earl Moon

| Should I use thermals or direct connects on | vias from BGA pads to power planes. The via is | connected to the BGA pad via a short 8mil trace. Thermals are safest. However, I have had no problems using direct connects provided parameters are capab

Dull joints caused by NiAu PCB surface ?

Electronics Forum | Thu Nov 01 17:40:52 EST 2001 | davef

Listen to Wolfgang. Your dull solder connection is a process indicator. Some 63Sn / Au solder connections look grainy, depending on how your process them and the materials involved. Gold dissolving in tin forms an intermetallic compound [AuSn4] th

Lead Free Component on solder paste (lead)

Electronics Forum | Thu Jan 03 08:32:28 EST 2002 | davef

You're correct. There's a range of issues. Two perspectives are: * TI and other suppliers has been shipping lead-free solderability protected leads on components for years. We have discussed, here on SMTnet, a need to adjust the reflow profile to

Plated through via's in pads.

Electronics Forum | Wed Feb 05 21:05:38 EST 2003 | davef

Iman On your situation: As an earlier poster stated, your options are limited to opening you stencil aperture to compensate for the paste lost to the via. On your designer's belief that "it helps in heat dissipation": Could be true, but: * Hole wil

Coolingproblem in reflow profile

Electronics Forum | Thu Jun 16 22:33:54 EDT 2005 | davef

Peter: Please explain: * You say, "The cooling phase is important to perform the strength of the solder joint." [We agree that fast cooling rates produce fine grain in solder and that fine grained solder connections are stronger than coarse grained.

solder SnPb wire to gold plated IC

Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef

Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,

SMEMA Configuration

Electronics Forum | Tue Dec 02 02:11:39 EST 2008 | raranchado

We're using a PFC (Product Flow Controller) box by Cogiscan between a conveyor and Agilent SJ-5000 (AOI) and the problem we're having is that when the downline smema cable is connected to the PFC box, the AOI conveyor belt keeps on turning even with

BGA Rework - Pads being lifted

Electronics Forum | Mon Apr 06 11:46:10 EDT 2009 | c111

I agree the longer soak will help provided you are not applying to much heat/time to the board now. -are the pads that lift connected to anything? This has happened to me in the past where un-connected pads would come of far easier than those connec

Quad IVC backup

Electronics Forum | Mon Jul 06 06:51:50 EDT 2009 | leemeyer

Many years ago we purchased a IOmega ZIP drive that would connect to the parallel port of the computer. They have a utility called "guest" that we installed on all of the IVC computers. We were then able to connect the drive to the parallel port and

Solder Paste not dry after Wave

Electronics Forum | Wed Feb 23 12:42:28 EST 2011 | davef

If we understand correctly, your SMT solder connections remelt when passing through the wave solder machine and your QA-people don't like it when that happens. It's nice not to remelt this solder, but as long as the board meets your acceptance stand


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