Electronics Forum | Thu Feb 13 10:38:51 EST 2003 | davef
Given that you are bridging front to back, contast the situation with the thiefs used to prevent bridging when wave soldering SOIC. If this is reasonable, the thiefs should be located behind the trailing connector pins. You can prove-out this [and
Electronics Forum | Wed Feb 12 13:37:22 EST 2003 | dwanzek
I need some input on what good solder thieves dimensions should be. I am limited to solving my bridging problem with solder thieves; all process/wave variables have been adjusted to try to solve this problem. There are several of these connectors on
Electronics Forum | Thu Feb 13 07:13:39 EST 2003 | davef
Tell us more about the location of the bridging [ie, front-to-back, back-to-back, front-to-front, etc]. Thoughts are: * Your annular ring around the hole seems large. You have 0.007", consider 0.003" to be the minimum. Your board fabricator can gi
Electronics Forum | Wed Feb 12 16:23:30 EST 2003 | russ
I agree with DDave, You have something else wrong! .100 dips with .05" lead protrusion should not bridge (in fact I would think that it would be almost impossible). Tell us about your machine, (laminar flow, A-wave, etc.., size of nozzle, wave heig
Electronics Forum | Wed Feb 12 13:45:15 EST 2003 | MA/NY DDave
Hi Good Luck, I worked a long time with THT components like you discuss and boards totally or partially populated. Dee Machines, Electroverts, Hollis and an other and never had the kind of problems you are listing stayed with us forever. I mean you
Electronics Forum | Thu Feb 13 10:15:09 EST 2003 | dwanzek
Bridges are front to back. To me this seems to indicate thieves would pull the solder away from the pins. I feel I am correct in that theory. Yes, it would be a good idea for us to bring in a consultant but I have the opportunity right now to make b
Electronics Forum | Fri Oct 15 18:09:49 EDT 2004 | teamcanada
No lead devices oxidize very quickly when washed. Try to keep it a no clean process. Solderability comes into play a bit depending on solder paste.
Electronics Forum | Sat Oct 16 09:03:48 EDT 2004 | davef
Here is a thread from the fine SMTnet Archives from a couple of weeks ago, where we spoke about the topic of mixed lead-free solder with components that have lead-bearing solderability protection: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Messag
Electronics Forum | Mon Jun 27 06:52:07 EDT 2011 | rpatel28364
Hi All We are facing problem with solderability of BGA connector. After Xray we have found open under BGA connector. After removing from PCB it seems some copper pads are still gold. We are not sure why this is happening. We have 5 thou stencil and
Electronics Forum | Sun Apr 03 00:34:56 EST 2005 | Andrew
Can anyone advise the best aperture opening and stencil thickness for Nexlev connector?We are seeing high reject for open solder.
