Electronics Forum | Thu Mar 13 14:12:31 EDT 2014 | davef
You're creating a new alloy on the surface of your board. The alloy will have a melting point determined by the constituent metals of the alloy. Your alloy consists of: * Lead-free HASL solderability protection on the board * Lead-free solder paste *
Electronics Forum | Tue Jul 19 06:07:30 EDT 2005 | GS
Yes Rob, I would like to know the type of metal finisching like JST097 or IPC-1066 or IEC .... suggest to do. I would like to avoid i.e. to get Bismuth finish on components terminals that I still have to solder with alloy containing Pb. Also to ha
Electronics Forum | Thu Sep 27 10:40:46 EDT 2007 | rgduval
Joris, Yep, very common to have those small blow holes in lead-free alloys. We used to get them very consistently on white-tin finished boards, and less frequently with gold finished boards, for what ever that is worth. IPC-610 actually allows t
Electronics Forum | Tue May 24 17:07:36 EDT 2005 | davef
Eric: For the amount of dross that you're removing, we're concerned that you could be loosing the balance of your solder alloy, because dross consists primarily of tin oxides. It has little lead in it, beyond than the lead content of the solder that
Electronics Forum | Thu May 25 03:31:17 EDT 2006 | slaine
Hi I manufacture ceramic parts that have a terminations that are palladium/platinum/silver or any combination of the 3. Termination Ink usually consists of 3 main parts the alloy, glass frit and binder. Binder is to help bind everything together whi
Electronics Forum | Tue Aug 07 19:32:40 EDT 2007 | davef
Zinc from the brass diffuses into the solder and reacts with tin causing dezincification. Dezincification is a specific type of de-alloying, or selective, leaching corrosion of brass fittings. This type of corrosion selectively removes zinc from th
Electronics Forum | Thu Sep 27 10:53:59 EDT 2007 | gregoryyork
Joris, > > Yep, very common to have those small > blow holes in lead-free alloys. We used to get > them very consistently on white-tin finished > boards, and less frequently with gold finished > boards, for what ever that is worth. > > IPC-6
Electronics Forum | Fri Apr 21 14:58:04 EDT 2023 | rgduval
I mean...there are a ton of possibilities for bridging on selective solder before you ever get to alloy purity. Are the bridges happening consistently in the same spot? Are the leads too long? Can you modify the approach/exit/peel off to address? Wh
Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir
Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers
Electronics Forum | Fri Feb 03 17:25:47 EST 2012 | tombstonesmt
We've been having issues with our current process of oven profiles. We use a high temp adhesive to bond the thermal couples to the desired components. The issue of them letting go or releasing during reflow temps are hit or miss. Majority of our buis
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