Electronics Forum | Tue Jul 25 11:04:03 EDT 2000 | rene
Lately I have noticed that many manufacturers of electronic (components) have problems in setting up their logistics structure in Europe (availability of parts, spares, reverse logistics, RMA shipments, leadtime constraints). Is there anyone who shar
Electronics Forum | Thu Jun 22 11:17:47 EDT 2000 | Mike
Can companies afford to place additional environmental constraints on the manufacturing process?
Electronics Forum | Fri Sep 25 10:30:07 EDT 2020 | majdi4
2 process to increase the robustness of the bga against all constraints
Electronics Forum | Sat Aug 17 07:34:36 EDT 2002 | bentzen
Hi Ken First of all, I think you are right to point out that the uptime should be calculated on the SMD line bottleneck. But I have some comments to your posting in general: The SMD line bottleneck, you say, is always the palcement machine. This i
Electronics Forum | Mon Oct 09 06:16:31 EDT 2017 | jamesbarnhart
I think you needed an IPC Class 3 annular ring because for very dense designs, the smaller the annular ring the better, as less space is taken by the pad or via and more space can be dedicated to routing the traces in highly populated areas of the bo
Electronics Forum | Mon Jun 18 12:31:21 EDT 2001 | ashokdha
Gil For BGA Inspection, What are the other technologies available to us ( e.g. infrared ? ultrasound ? laser ? Mirrors ? ) Can you provide your perspective on that ? How safe and cost effective the X-Ray system is as compared to other methods of i
Electronics Forum | Fri Nov 12 17:58:18 EST 1999 | Jason Nipper
I have been actively experimenting with Selective WS pallets fabricated from Delmat. I need feedback from users on life expectancy, demesion constraints relative to warpage or degradation, and any useful info on ways to maximize life and prevention
Electronics Forum | Fri Jul 30 18:34:51 EDT 2010 | ranas
hi, just want to seek info regarding LF supplier who can do flip chip LF with solder nuggets. our supplier from USA is going to be closed due to financial constraint.. Anybody who can recommend.. asia location is preferrable.. thanks, Ranas
Electronics Forum | Tue May 28 12:29:29 EDT 2024 | carl_p
Depends on the product & constraints your having to deal with. I've used the following in the past; Stepped Stencil, Overprint, Additional dispensing equipment after the print process & Solder pre forms
Electronics Forum | Mon Sep 25 17:14:40 EDT 2000 | LarryK
Greg, Its an open ended question your asking here. What are you trying to do? Determine if your equipment is able to do what you need? E Determine your floor spacing? Determine what, if any, inspection equipment is needed? Determine constraints/line
