Electronics Forum | Mon Sep 24 12:47:37 EDT 2007 | PJ
I am doing some research on flux free/flux less SMT reflow soldering. Do you have any equipent/process recommendations? Does anybody use it for volume production and what are the constraints (finish, balls, paste, vacuum, pressure, size)? What is
Electronics Forum | Thu Jun 19 12:07:09 EDT 2008 | ck_the_flip
You answered your own question! Vapour phase is the way to go for this. Conventional ovens won't allow this, unless you find away to defy Physics. That's an absurd constraint to begin with: 200C. Most Sn-Pb profiles require 205 - 210 minimum for
Electronics Forum | Thu Jun 19 12:27:14 EDT 2008 | guqing
Thanks CK. You are right the 200C constraint is absurd, but it's the reality, and the worst is this kind of components will go through lead-free profile. Do you or any body here experiencing the same problem? any body using Vapor phase and having suc
Electronics Forum | Mon Aug 02 11:16:38 EDT 2010 | sdibuyer
Can anyone recommend a reputable / knowledgeable SMT expert in the Bay Area to work on a contract / consultant basis? 10-20 hours per week for 3 - 6 months. This person will assess solder joint health, drive DOEs to maximize results within existing c
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
Electronics Forum | Fri Jun 15 13:06:15 EDT 2001 | CPI
I Agree with Dave, Check spec on cap some devices have temp constraints (can exceed x degrees for more than x time or can not exceed a certain ramp rate). Check that then go through the rest of the process chances are its not your machine if no other
Electronics Forum | Thu Jun 21 07:06:18 EDT 2001 | gdstanton
I'm constantly being flooded with information by sales reps on x-ray and other types of equipment to inspect BGAs. Most of these items are simply beyond our capital budget constraints. I've witnessed dozens of demos, and to be honest, I really don'
Electronics Forum | Fri Feb 13 18:50:27 EST 1998 | C. Lao
I'm in the process of running a no-clean paste evaluation. I'm presently writing the specifications for the laboratory test requirements (SIR testing, flux testing, etc.). So far, I've developed a very comprehensive set of test criteria using muc
Electronics Forum | Mon Nov 25 22:08:05 EST 2002 | Ben
Thanks for the advise. I got the advise from my solder paste vendor to increase the time above melting point for flux outglassing to escape. I tried but no big help. For the moisture issue, actually I've try to bake both the PCB and components at 12
Electronics Forum | Tue Apr 01 09:36:25 EST 2003 | davef
You're correct. There is no way you can aquous clean under a low stand-off part like a LGA. Your approach seems reasonable, given your constraints. [As long as your customer is paying, what the hey!!! Give 'em what they want.] Consider joining t
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