Electronics Forum | Thu Jun 19 12:27:14 EDT 2008 | guqing
Thanks CK. You are right the 200C constraint is absurd, but it's the reality, and the worst is this kind of components will go through lead-free profile. Do you or any body here experiencing the same problem? any body using Vapor phase and having suc
Electronics Forum | Mon Aug 02 11:16:38 EDT 2010 | sdibuyer
Can anyone recommend a reputable / knowledgeable SMT expert in the Bay Area to work on a contract / consultant basis? 10-20 hours per week for 3 - 6 months. This person will assess solder joint health, drive DOEs to maximize results within existing c
Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar
Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h
Electronics Forum | Fri Jun 15 13:06:15 EDT 2001 | CPI
I Agree with Dave, Check spec on cap some devices have temp constraints (can exceed x degrees for more than x time or can not exceed a certain ramp rate). Check that then go through the rest of the process chances are its not your machine if no other
Electronics Forum | Thu Jun 21 07:06:18 EDT 2001 | gdstanton
I'm constantly being flooded with information by sales reps on x-ray and other types of equipment to inspect BGAs. Most of these items are simply beyond our capital budget constraints. I've witnessed dozens of demos, and to be honest, I really don'
Electronics Forum | Fri Feb 13 18:50:27 EST 1998 | C. Lao
I'm in the process of running a no-clean paste evaluation. I'm presently writing the specifications for the laboratory test requirements (SIR testing, flux testing, etc.). So far, I've developed a very comprehensive set of test criteria using muc
Electronics Forum | Mon Nov 25 22:08:05 EST 2002 | Ben
Thanks for the advise. I got the advise from my solder paste vendor to increase the time above melting point for flux outglassing to escape. I tried but no big help. For the moisture issue, actually I've try to bake both the PCB and components at 12
Electronics Forum | Tue Apr 01 09:36:25 EST 2003 | davef
You're correct. There is no way you can aquous clean under a low stand-off part like a LGA. Your approach seems reasonable, given your constraints. [As long as your customer is paying, what the hey!!! Give 'em what they want.] Consider joining t
Electronics Forum | Mon Jan 31 13:48:22 EST 2005 | John S
We have a line using the DEK Pump Print process. We use a 3mm plastic stencil and print adhesive through it. The adhesive we use is Heraeus 955. We've struggled with adhesive contaminating the pads of our smaller components. The deposit isn't on
Electronics Forum | Fri Mar 09 06:04:18 EST 2007 | phil69
Hi, I am currently looking for a replacement solvent to remove RMA flux from Hybred Ceramic Substrates after reflow. We are currently using Dichloromethane in a Crest AVD500 wash. This solvent carries an R40 risk phrase, hence we are on a drive f
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