Electronics Forum | Thu Aug 21 08:59:05 EDT 2008 | rway
I would say yes. I don't believe that ICT will every be replaced by boundary scan. Now on some assemblies, boundary scan is viable and certainly a better choice considering test access constraints. But ICT still will play a vital roll in the futur
Electronics Forum | Thu Jan 15 03:20:59 EST 2009 | sachu_70
Hi Andrzej, I guess you mean peelable solder resist. Good idea to try during R&D, but certainly not a solution on production floor. Also, few constraints to be considered such as presence of entrapped air between component and solder resist, the natu
Electronics Forum | Fri Apr 17 13:55:33 EDT 2009 | grantp
Hi, If you don't have a space constraint, why not check out the XPF machine. We just got the second XPF-W machine in the world to ship, and it's amazing. Huge boards, and the same feeders as NXT. Auto backup pin, feeder change on the front of the ma
Electronics Forum | Mon Apr 28 21:51:56 EDT 2014 | elabcircuits
Hello, We have a MPM UP2000 HiE printer from 2000, software version 7.2E. The PC board is not booting anymore (black screen), no drives spinning. It's an Advantech 486SX version. Question: would a Pentium 3 SBC (Single Board Computer) with ISA
Electronics Forum | Thu Nov 13 05:35:50 EST 2014 | jlawson
Valor-Mentor has bardcode based verification solution with machine connection and control for most machines on market and options to connect to machines in various ways to lock system until verification process is done. Handles splicing and led binin
Electronics Forum | Thu Nov 13 05:36:37 EST 2014 | jlawson
Valor-Mentor has bardcode based verification solution with machine connection and control for most machines on market and options to connect to machines in various ways to lock system until verification process is done. Handles splicing and led binin
Electronics Forum | Mon Dec 16 00:08:18 EST 2019 | ameenullakhan
Hi Norah, Thanks.. Components are stored in controlled environment of 20 to 25 deg c & 40 to 60 % humidity. Baking wont be feasible for many parts. Mainly for passive parts in tape and reel. 0402, 0603 & 0805 packages. Cold baking is not feasible
Electronics Forum | Mon Oct 19 23:02:21 EDT 1998 | john godfrey
| We have just recently started using the Overall Equipment Effectiveness (OEE) metric on our SMT lines. This measurement is the "equivalent percentage of time the equipment is being used to produce saleable product at the maximum machine rate." Th
Electronics Forum | Tue Jul 18 03:49:43 EDT 2000 | Chris May
50% of cost, bin it. If viable, spend no more than that time to fix. Then concess or use as is. 3) Components are more tricky. Can they be returned to supplier if deemed to be faulty? (proof?). Is/was there an in-house handling problem ? Have design
Electronics Forum | Mon Jun 11 14:25:36 EDT 2001 | CPI
I had the very same problem but, did not question my oven as I knew the profile was good and I should have had even heating. So I then looked at pad size and layout. When Layout and size were found to be ok. I attached a prob to each pad and ran a pr
