Electronics Forum: consumables calculation example (Page 5 of 11)

Solder wave shutdown

Electronics Forum | Thu Jun 07 16:33:15 EDT 2007 | mumtaz

Please, it does not matter the school from which it is you came, but what you learned from it that counts. It is simple mathematics my friends. Lets make things simple, shall we not? E=I/R..... this we all should know. We can use this to measure

Re: footprint formula

Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko

Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir

Re: footprint formula

Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko

Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir

Solder paste amount

Electronics Forum | Tue Jan 16 09:23:26 EST 2001 | P.Gerits

Hello, Standard way to calculate stencil design can be done as follows: A normal ratio of aperture width/stencil thickness = 1.5 for pitches below 650u A normal ratio of stencil aperture width against pad width = 0.8-0.9 (or stencil aperture 10%-20

Fine Pitch Pad Width Size VS Component Lead Width

Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu

Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Sep 04 13:41:52 EDT 2001 | Brian W.

IPC7912 deals with the end result, ie an OEM getting boards from a contract manufacturer. I have a friend who is sitting on these committees. He tells me there is a new standard due out for actually doing in-process DPMO. From a process standpoint

Capability Process CPk

Electronics Forum | Fri Jan 17 16:24:04 EST 2003 | MA/NY DDave

Hi I haven't seen the DEK software you describe in action or studied it, yet I will tell you to be careful of some of the software on the market even from good companies. Spend the time needed to understand how the software makes the calculations,

How to identify SMT line's capacity

Electronics Forum | Mon Jun 28 02:10:10 EDT 2010 | tpvnew

Thank you very much for your reply. I do have the numbers for placement per hour, but, I have some concerns on it (forgive me if it is a stupid concern, as I said, I am new in this field, and trying to figure out this business). For example, it is

How to define solder paste printing height tolerance

Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef

Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u

EPR software

Electronics Forum | Tue Aug 27 02:55:43 EDT 2019 | oxygensmd

I am looking for a simple software which I can use in my production. I have the following task which I would like to solve with this software: - Components storage: counting the components in my production area. I would like to store their following


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