Electronics Forum: consumables calculation example (Page 6 of 11)

Re: DPM-Rate for SMT pprocess

Electronics Forum | Tue Oct 06 15:41:14 EDT 1998 | Mike C

| | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medium b

Re: Shelf Life of Assemblied PCB's

Electronics Forum | Wed Aug 04 12:35:15 EDT 1999 | Dave F

| | | | I have been asked to supply a maximum shelf life for our assemblied PCB's. I realise this is dependent on so many factors- temperature, humidity, no of layers etc. But does anyone have a formulae for calculating shelf life, or does anyone kno

Re: IQ/OQ, and PQ

Electronics Forum | Wed Sep 15 11:08:45 EDT 1999 | Dave F

| I am looking for help on doing smt equipment qualifications. I need to find some examples to follow. The equipment to be qualified is a Stencil Machine, Pick and place machine, and Reflow oven. We manufacture medical devices so it has to be somewha

MSL/MSD Tracking

Electronics Forum | Thu Aug 21 16:33:49 EDT 2008 | decaire

The 2 most common approaches for MSD Tracking and Control on the factory floor are: 1) Manual paper-based procedures (Example: Log Sheet or Label that the operator must fill out and pay attention to) - or - 2) Software-based tracking system (Example

Re: solder balling

Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish

Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the

Re: Parts Packaging Data

Electronics Forum | Thu Aug 05 04:32:21 EDT 1999 | Wolfgang Busko

| I am currently in the process of setting up an SMD Parts Package Database. The database will contain dimensional information to be used by the placement machinery to process parts (I.E Package Type, # of Leads, Lead dimensions, Lead pitch(s), etc.

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 14:42:55 EDT 1998 | Justin Medernach

| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.

Machine good/bad points

Electronics Forum | Fri Mar 29 11:12:34 EST 2002 | stefwitt

I can not tell you which machine types are the majority in the market. For these numbers you should contact Charles Henry from Ceeris. I guess with the term low quantity / high volume you mean low mix / high volume which means low variety of differe

Is Anyone?

Electronics Forum | Wed Jul 31 01:40:46 EDT 2002 | kenbliss

Cal and everyone else on this forum I completely agree. Everyone needs to keep in mind, not everything is going over to China. The press says it is, they also told us the stock market was great and then they said the stock market was bad. The medi

Solder wave shutdown

Electronics Forum | Wed Jun 06 15:59:25 EDT 2007 | chrisawallace

WML, I won't dispute math but I will definitely point out either bad math or a missed target. In your example, you are comparing "Energy used to heat the solder and keep it warm" versus "Energy used to keep the solder warm" and fully discount the fa


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