Electronics Forum | Mon Aug 03 12:04:39 EDT 2009 | davef
Loco: Your post seems to be pasted from a Alpha Metals SACX0807 application sheet. We don't understand the relationship between your SACX0807 and Hoss67 SN100C. They're different alloys.
Electronics Forum | Thu Aug 06 05:57:10 EDT 2009 | lococost
Indeed Dave, But I can't image the extra .5% silver that alpha adds to sn100c will make a huge impact on the difference between the behaviour of the 2 alloys, especially considering SAC gets exactly the same recommendation.
Electronics Forum | Mon Aug 03 04:51:58 EDT 2009 | lococost
From alpha metals lead free alloy impurities bulletin: "Levels greater than 0.025% may start to slow the wetting speed and could affect the hole fill performance. If process performance is OK then levels up to 0.05% are OK."
Electronics Forum | Thu Oct 05 11:59:51 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon all! Theoretically, there should not be any issues soldering to the SN100C as the tin content of the molten paste alloy should wet to the finish with no problem. I would just ensure that the peak temperature of the joint is above the
Electronics Forum | Thu Jul 30 14:16:27 EDT 2009 | joeherz
We are running a selective solder machine using SN100C alloy. We have had J-STD-001 analysis performed every 2 months and our last analysis showed our nickel content at 0.104%. The max allowed is 0.100%. We changed out the pot (only 30 lbs) but I'
Electronics Forum | Fri Apr 09 09:08:40 EDT 2010 | cast2010
Hello, I produce two types of board. - 100% Thru Hole - 50% thru hole and 50% SMT For the second, I have a bad wetting after the reflow on the top. The pcb board have Au-Ni pad. I use a water soluble paste. I clean the board with a solution with
Electronics Forum | Wed Sep 27 23:52:28 EDT 2006 | fctassembly
Hello Steve, Yes, there are differences in the various alloys and I have described briefly below these differences: SN100- a common name for 100% tin that is used to increase the tin content in 63/37. SN100C-Name for Tin/Copper/Nickel/Germanium all
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly
Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte
Electronics Forum | Tue Mar 28 13:29:45 EST 2006 | solderiron
SN100C, not as aggressive towards other metals as are other High tin lead free alloys. Why? Sn63/pb37 The lead prevented the tin from being very aggressive. SAC305 no lead, silver instead. Silver doesnt block Tin from it's aggresiveness. SN100C no si
.gif)
