Electronics Forum: contract vapor phase reflow (Page 10 of 14)

Entry-Level PnP + BGA?

Electronics Forum | Fri May 04 13:42:11 EDT 2012 | spoiltforchoice

The Manncorp machines are Autotronik machines re-branded. These are Chinese built while pretending to be German, they are seemingly capable enough and do come in at very attractive price points. The FLX from Essemtec is in many ways a slicker machine

Batch Ovens

Electronics Forum | Wed Nov 02 17:49:07 EST 2005 | grantp

Hi, We used a batch oven from Reddish Electronics out of the UK. It was convection, and ok, but had limitations. Batch convection ovens start to heat up, so the metal of the oven is hotter and hotter and it effects the profile. So we ended up need

No such thing as a Compact Reflow Oven?

Electronics Forum | Sun Mar 18 20:02:48 EDT 2018 | reckless

Thanks for your help every time! You are right table top units are a joke. For smaller conveyor ovens I found two major brands: Manix (no longer makes ovens) and Manncorp. The manncorp unit I am looking at does not have a bottom heat zone. Mos

SIR starting point...?

Electronics Forum | Mon Oct 21 22:15:36 EDT 2002 | davef

First, SIR data is heavily dependant on the test pattern selected. Be very careful when comparing the results of resistance readings taken from different geometric patterns. Second, if yer talkin': * Bare boards, yupper. * Finished assemblies impor

Re: Metal based PCB reflow.

Electronics Forum | Wed Jun 09 17:29:59 EDT 1999 | Earl Moon

| I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | There is anybody has experience on metal-based PCB reflow process? I guess

Re: Metal based PCB reflow.

Electronics Forum | Thu Jun 10 11:23:10 EDT 1999 | Gang Pan

| | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | There is anybody has experience on metal-based PCB reflow process? I g

Re: Temperature profile req's for Pin In Paste process

Electronics Forum | Sat Apr 11 14:31:16 EDT 1998 | Gary Simbulan

| | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusive R

Re: Simultaneous Double Sided Reflow

Electronics Forum | Tue Dec 29 10:36:38 EST 1998 | Earl Moon

| I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | Is there any one who has been running this process in production ? | | Yes I do mean reflowing

Re: Simultaneous Double Sided Reflow

Electronics Forum | Tue Dec 29 12:18:17 EST 1998 | Ryan Jennens

| | I have been working on this process for a couple of weeks and I know that there are a few other companies in Europe and Japan who are also playing. | | | | Is there any one who has been running this process in production ? | | | | Yes I do mean

Reflow Oven Selection

Electronics Forum | Wed Aug 31 10:26:24 EDT 2005 | Carmichael

I respectfully disagree with vapor phase or reflow oven being the technology of choice here. Have you considered straight conduction heating? (ie: hot plate) If you have a lot of these to do you can purchase in-line conduction ovens like the Sikama o


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