Electronics Forum: control techniques (Page 1 of 8)

Stencil Printing Process Troubleshooting and control

Electronics Forum | Thu Oct 17 17:18:48 EDT 2002 | Leandro G. Barajas

Hi everybody, This is a simple posting to initiate a discussion on different ways to troubleshoot, improve, and control the Stencil Printing Process SPP in SMT manufacturing. There are many SPC, ANOVA and other analysis techniques that provide insi

SPC, PPM and DPMO

Electronics Forum | Fri May 23 15:31:46 EDT 2003 | daanterstegge

Hi ChrisX, DPMO = number of defects per million opportunities. PPM (parts per million) is exactly the same, although the terminology is less clear about what it means. SPC(statistical process control) is a methodology based on statistical technique

Flux dip or solder print for CSP

Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining

Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure

The ever-expanding reference library

Electronics Forum | Tue Jan 30 21:20:08 EST 2001 | davef

Juran�s "Quality Control Handbook" [McGraw Hill] is an excellent resource. It is, by and large, accessible by those who are not conversant in the Central Limit Theorem [like who is?], although it will help explain whatever that thing is that I just

EMI

Electronics Forum | Sat Oct 05 07:29:48 EDT 2002 | davef

Design for the Environment (DFE) / Electromagnetic Compliance (EMC) ------------------------------------------------------------------- "Noise Reduction Techniques in Electronic Systems" Henry W. Ott, John Wiley & Sons, New York, 1976 Seltzer, G.S.

Anti scratch film

Electronics Forum | Thu Dec 05 17:59:14 EST 2013 | hegemon

By hand, we apply a precision die cut plastic protective film to a particular "lens" product. It is of the "peel the backing off and apply" style product. Due to the ESD event possibilities, this application is done in an area far away from any ele

Re: Gold Immersion - Soft Joints

Electronics Forum | Mon Nov 01 11:07:36 EST 1999 | William

Thank you so much Dave for all of your wonderful help. You know, all I really wanted to know was a little more about the gold porosity problem. Since I am not an expert on gold immersion, nor do I claim to be, I just wanted some information so that

Rejuvenated solder paste

Electronics Forum | Tue Dec 21 11:46:29 EST 2004 | KEN

Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my mind, is an unacceptable technique. Why? 1. Can not control metals content. 2. Probably not adding the same chemestry flux...as paste flux has many different addi

dry solder paste

Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj

Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m

Immersion Gold over Nickle de-wetting problem

Electronics Forum | Fri Mar 07 10:51:58 EST 2003 | MA/NY DDave

Hi O'Conner, I hope you also tell us what Universal-GeorgeW discusses with you. It is a little strange seeing his name on this list and his phone number. Gee I can give you his email address but won't.. Again distance engineering is tough. I woul

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