Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller
Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.
Electronics Forum | Mon Feb 20 15:03:56 EST 2006 | davef
Q1- Will we be able to select the materials (flux and alloy) and run the process depending only on ourselves, distributors� help, machinery documentation, web data and �trial and error?� A1- Your materials suppliers [eg Kester, Alpha Metals, etc] wil
Electronics Forum | Thu Mar 30 07:44:06 EST 2006 | samir
Is your customer hands-off when it comes to what type of process materials you use on their assemblies?? In the world of Contract Manufacturing Hell, you'll have a mixed bag of customers...some, who don't care what materials you use - after all, YOU
Electronics Forum | Wed Apr 26 14:06:46 EDT 2006 | mdm4ua
Hi JEM, We just made the very same upgrade you are looking to make on three machines. We purchased a new MY12 and upgraded our other three (My9 W/hydra, My9 No Hydra, and TP9-2U) from 2.2.4C to 2.4.4c. There are several changes and most of the
Electronics Forum | Sat May 06 22:03:57 EDT 2006 | mika
There is a ISO Standard 14644-1 Class Limits, but I don't know if if this is applicable in the "so callled" SMT standard production scenaraio and if so, what class would it be? I hope that some other nice guys will correct me, or have i totally lost
Electronics Forum | Mon May 29 04:02:51 EDT 2006 | vasily
Hi Efren Unfortunately I cannot say about prices, because I don't know them in your region. But I can offer you to consider the world-leader manufacturers of each type of equipment. I think you can obtain all information through their web-sites. We s
Electronics Forum | Wed Jun 21 11:09:37 EDT 2006 | samir
Muse, I agree. There has been much debate but the previous scenarios discussed in the forum have been regarding the SAC/RoHS BGA and Sn-Pb paste. I have successfully collapsed a SAC BGA with a Sn-Pb paste using the "hybrid" profile that Amol refers
Electronics Forum | Thu Jun 22 19:43:05 EDT 2006 | davef
We hope this meets your standards for acceptable responses. * http://www.uic.com/wcms/images2.nsf/(GraphicLib)/Time_Pressure_Dispensing.PDF/$File/Time_Pressure_Dispensing.PDF * On the Flow Rate Dynamics in Time-Pressure Dispensing Processes; X. B. C
Electronics Forum | Wed Feb 21 06:11:41 EST 2007 | CL
Good Morning, We have 5 Mydata MY machines in separate lines. We are placing 0201's, uBGA's, CSP's, etc.... I cant say that we have never had accuracy problems but whatever caused the problems was identified and they are fairly accurate as far as I'
Electronics Forum | Thu Aug 10 10:13:11 EDT 2006 | pjc
I have never seen any industry standards for setting up an SMT assembly facility, but I�ll offer some basic advise. An ideal SMT assembly facility is one that is clean and well lit and has environmental controls to maintain temp and RH. Temp of 24C (
