Electronics Forum: conveyor direction on asys conveyor (Page 1 of 2)

How to change conveyor direction on EKRA E4 screenprinter ?

Electronics Forum | Tue Oct 01 11:48:01 EDT 2013 | bengt

Hi All. We have bought EKRA E4 screenprinter. We are running R to L and printer has L to R direction. Does anyone can help me on this ? On specs it says all kind of directions.

How to change conveyor direction on EKRA E4 screenprinter ?

Electronics Forum | Sun Oct 06 12:18:03 EDT 2013 | christian01976

Hello! Go on the Service Button (bottom right) password could be 2211 or 9060. In that menu you should be able to change direction. Please tell me if it works! Bye Christian

How to change conveyor direction on EKRA E4 screenprinter ?

Electronics Forum | Fri Jan 24 06:36:42 EST 2014 | cbeneat

For operator, try 4530. To change the password, I think it's done in the password INI file.

How to change conveyor direction on EKRA E4 screenprinter ?

Electronics Forum | Thu Jan 23 15:57:58 EST 2014 | bestglobalsmt

Hello! > > Go on the Service Button (bottom right) > password could be 2211 or 9060. In that menu you > should be able to change direction. > > Please > tell me if it works! > > Bye > > Christian christian - do you have any idea where the op

Question on Cyberoptics Sentry 2000 implementation

Electronics Forum | Fri Jul 16 11:13:46 EDT 2004 | Inspection Solution

Hi John, If you have any questions on any of the CyberOptics equipment, please feel free to contact http://www.lvtechnologies.com. There is no charge for helping answer any questions. Full service, sales (parts and equipment) and support is also a

Re: Need help on DFM rules

Electronics Forum | Wed Jun 02 15:27:27 EDT 1999 | JohnW

| | Hi, | | | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | | | Can somebody help me get started or give some usefull tips on where

THM Solder barrel fill issues on 93 mils board

Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew

I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 00:26:04 EDT 1999 | Karlin

| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl

component aherence force on the solder paste before reflow

Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte

If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at

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