Electronics Forum | Fri Sep 08 12:03:24 EDT 2017 | rameshraja
Hi, I need the RF 800 Flux Acid titration procedure and also require EPT of the same to add thinner ( RF 800 additive), i.e we are using the flux rf 800 for our wave soldering process having foam fluxer , after 2 hours we are taking sample from the
Electronics Forum | Wed Dec 06 06:09:02 EST 2006 | Loco
Would say about the same as above, 8mm according to a cookson presentation we had, of course it would depend a bit on the paste you are using.
Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006
We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing
Electronics Forum | Mon Jun 23 12:50:49 EDT 2003 | russ
There are coatings available for Stainless that will greatly retard the solder from wetting to/eating the metal. This may be a cheaper route to go than Using all Titanium. The coating is melonite QPQ (quench-polish-quench)I really don't have any mo
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Wed Mar 02 04:52:42 EST 2005 | GV
Cookson solder paste 256 seem to be a good and very active no clean solder paste. We have some good experience. We did not bother to evaluate oters since we have had good results with this solder paste. May be you can try. Most important is the reflo
Electronics Forum | Thu Oct 01 06:22:48 EDT 2009 | rajeshwara
We approved the Reflow Profile from Cookson Solder Paste Manufacturer we are using. Now I am suspecting on method of vias designing below that QFP.There is exposed pad for that QFP and we print solder paste there , but when i see under x-ray there is
Electronics Forum | Wed Aug 13 11:13:03 EDT 2008 | mbnetto
Hello... I need to calculate the solder paste quantity that I'll need for a new product and I need the density of the solder paste Cookson OM338PT. Can anybody help me? Thanks!
Electronics Forum | Sun Sep 27 22:39:55 EDT 2009 | rajeshwara
The same issue i faced 2 yrs before , i sugest 1. Use stencil of 4 mils ( Take care of Aspect Ratio and Area Ratio ). 2. Use Solder Paste of Type 4.5 and Viscosity in between 1100 to 1300. ( Try Solder Paste of Cookson or Alpha metals : OM338 T45-L
