Electronics Forum | Tue Jun 21 07:39:23 EDT 2005 | davef
There's a fair amount of material on cooling rates for lead free on the web. Look here: * http://www.speedlinetech.com/docs/Cooling-Slopes-Lead-Free-Reflow.pdf * http://www.findarticles.com/p/articles/mi_qa3776/is_200412/ai_n9473486 * http://www.m
Electronics Forum | Fri Apr 30 10:39:15 EDT 2004 | Bryan She
I found much ICT fails on the same location(Ref.des:Q166) on my boards. 1.Defects rate:more than 20%. 2.We measured the value of the transistor before reflow oven,it's ok.but measure again after been reflowed,result is fail.it seems fails happen duri
Electronics Forum | Mon Feb 10 12:35:11 EST 2020 | emeto
on 10 zone ovens with 3 cooling zones, my negative slope is between 2.5 to 4 deg C/second based on board size and thermal mass.
Electronics Forum | Thu Sep 16 01:54:46 EDT 2010 | sachu_70
Hi Gani, Immersion Ag finish has lesser shelf life as it can get more easily oxidized on exposure. However, I see concern in your Reflow profile. A few questions: Have you compared your reflow profile to the solder paste manufacturer's recommended pr
Electronics Forum | Tue Apr 09 00:09:25 EDT 2002 | craigj
Question. When profiling and looking at the profiles cooling rate. Over what temperature range should the slope be monitored and what sort of cooling rates should be looked for. Paste supplier says no more than 6degC per sec, some components maybe lo
Electronics Forum | Sat Dec 30 04:23:50 EST 2023 | 012band
I have used LTS (Sn57.6%Bi0.4%Ag) solder balls for soldering on Ni/Au pads, and I have observed a wrinkle pattern on the ball surface. When you attempted soldering on CuOSP substrate pads under the same conditions, the surface appeared normal. Additi
Electronics Forum | Thu Apr 07 11:39:48 EDT 2011 | remullis
My oven profile is 155,160,165,180,220,245,255,227 Cooling Zone 132/92. This is a 8 zone CV820 Technical Devices oven. My assy profile using Datapaq Q18 - Base on one probe feedback - Positive slope (7.09), Pos Slope Time (.45), Rise Time (1.17), Me
Electronics Forum | Sun Feb 27 17:06:18 EST 2005 | Darby
This is the profile we came up with on a 1500 to satisfy the parameters suggested by Indium. This was on an FR4 1mm thick 4 layer pcb that I would descrbe as medium density, QFP, SOP, AL-CAP, TANTS, D-PAK, MINI SPRING COIL, SOT and CHIPS were all use
Electronics Forum | Wed Jan 22 14:53:50 EST 2003 | MA/NY DDave
Hi I thought I would come back to this one for a second. Joe Fox above gave a nice concise note as to why you must raise the temp high enough above the soldering melting temp (liquidus) yet not too high. You want to go high enough for paste so tha
Electronics Forum | Tue Apr 09 07:41:08 EDT 2002 | johnw
Craig, it depend's n what you want to look at. In term's of te gran structure of the solder jont that's formed when the joint is cooling so you'd want to monitor the temperature drop from the peak or say 215dg C for ref down to probably about 150 an
