Electronics Forum: coplanarity defect (Page 1 of 4)

Re: BGA coplanarity

Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette

John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th

Micro BGA coplanarity

Electronics Forum | Fri Mar 21 21:13:03 EST 2003 | iman

Russ, u mean excess flux causes "blow hole" defect?

No-Lead solder defect - No solder on pads

Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel

Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o

No-Lead solder defect - No solder on pads

Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel

I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa

Humidity bake bends leads

Electronics Forum | Fri Apr 16 09:40:04 EDT 1999 | Gerry G

While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. I thought I'd ask some experts. Any help guys?

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:02:39 EDT 1999 | Dave F

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Gerry: I imagine there could be s

Re: Humidity bake bends leads

Electronics Forum | Sun Apr 18 03:58:26 EDT 1999 | P.L. Sorenson - Technical Consultant

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | To remove moisture from low quanti

Re: Humidity bake bends leads

Electronics Forum | Mon Apr 19 17:44:43 EDT 1999 | Chrys Shea

| | While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | | I thought I'd ask some experts. Any help guys? | | | Gerry: I imagine there co

Re: Humidity bake bends leads

Electronics Forum | Fri Apr 16 19:52:39 EDT 1999 | Scott McKee

| While trying to sell me a low temperature baking system for SMDs the salesman mentioned that the 125C for 24hr bake had been known to cause co-planarity defects. | I thought I'd ask some experts. Any help guys? | Let me get this straight... He's

Re: Defects Definition

Electronics Forum | Tue Feb 08 03:14:37 EST 2000 | Roni H.

Hi Jose, J-lead are very sesitive to coplanarity, which is the major cause for the defect you described. Other posibility is that there is not enough solder paste ; J-lead need around 10% more solder past then L-lead, You have to consider the screen

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