Electronics Forum | Thu Feb 20 17:18:24 EST 2003 | davef
Give us infortmation, please. What is [are]: * Height board to board side of the interposer on the low side of uBGA * Height board to board side of the interposer on the high side of uBGA * Alloy of solder balls, no paste was used correct? * Type of
Electronics Forum | Mon Mar 24 08:57:20 EST 2003 | russ
I don't know if I would call it a "blow hole". what I believe happens (I don't have a camera to watch spheres during the reflow process) is that when the flux starts heating up, expansion, bubbling, or something physically displaces the balls. We fo
Electronics Forum | Fri Dec 17 15:11:34 EST 1999 | Alvin Kevichusa
Let's look at it this way... Imagine a multileaded component sitting on a flat surface. If all the leads touch the flat surface, they are all in the same plane (that of the flat surface) and are coplanar. Coplanarity is desirable because if a lead is
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Fri May 21 11:59:24 EDT 1999 | John Eramo
Has anyone had any experience or data using vibration during the reflow process. We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked very
Electronics Forum | Tue Nov 09 20:16:31 EST 1999 | Thomas
10% slump). I am finding out their test std used but I think those lab test is different from real reflow as the heat transfer rate of reflow oven is much higher. Any one care to share your views?
Electronics Forum | Thu Nov 11 00:59:42 EST 1999 | Charley Qin
Hi, TOM Did you check your oven's chain movement? Is it stable? Good luck.
Electronics Forum | Mon Feb 13 13:43:54 EST 2006 | pjc
You will begin to de-wet at a high TAL and actually likely see all of the conditions you list.
Electronics Forum | Mon Jul 12 09:13:08 EDT 1999 | Mark Charlton
I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-layer
Electronics Forum | Tue Jan 06 21:19:05 EST 1998 | Dominic Nguyen
We use no clean paste and sometimes experience flux splattering which gives spot on gold fingers. Need help in analize the cause. thx.
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