Electronics Forum: coplanarity for qfn (Page 1 of 8)

Aperture shape for DPAK

Electronics Forum | Fri Oct 11 16:25:43 EDT 2013 | scdunlap

Also coplanarity can be poor on these parts so overprinting the paste (beyond the pad perimeter) can increase volume to insure robust solder joint.

Screen Printing for BGA

Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin

With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to

Screen Printing for BGA

Electronics Forum | Tue Aug 26 14:13:46 EDT 2003 | robd

We have seen "coplanar problems" on BGAs supplied by some suppliers. We have seen large enough spere variation to cause opens with our standard .006" paste process (paste and profile work fine "most" of the time) . Although not an extremely technic

Screen Printing for BGA

Electronics Forum | Wed Aug 27 14:41:49 EDT 2003 | Stephen

Have you checked the temperature profile at the balls? Just because a recipe works "fine most of the time" does not mean it is optimum. Do you have a machine that can measure co-planarity? If I get time I plan on using the MPA to look at co-plana

Need Help for CCGA Rework

Electronics Forum | Wed Nov 02 03:00:56 EST 2005 | GS

CCGA coplanarity was from 6 to 8 mils (better was CAST type) Regards........GS

Need Help for CCGA Rework

Electronics Forum | Tue Nov 01 19:56:41 EST 2005 | KEN

GS what was a typical coplanarity spec. on CCGA? I have one particula device that is 8 mil!

Need Help for CCGA Rework

Electronics Forum | Fri Nov 11 09:06:08 EST 2005 | russ

We use at least an 8mil thick stencil for these parts. The Columns do not collapse or reflow so you need to ensure plenty of solder volume for reliable attach and to make up for the coplanarity of the component itself. I assume we are not really ta

warpage for 152mm length PCB

Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef

Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies

Stencil apertures for SOT639-2 package

Electronics Forum | Fri Feb 16 09:40:19 EST 2007 | kmeline

I am looking for recommendations for working with this package. We have ran some QFN20's but this one is a little smaller and lead-free. If anyone has experience with this, I welcome your comments. Thanks

QFN shape on Fuji Flexa for CP6

Electronics Forum | Mon May 31 22:52:14 EDT 2010 | fujiphil

I think placing QFN in CP6 will be no problem....

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