Electronics Forum | Sun Aug 15 04:43:15 EDT 2004 | Danish
Can anyone advise how to measure flatness of a surface?Flatness on top of IC..
Electronics Forum | Mon Aug 16 09:17:13 EDT 2004 | russ
For flatness - Put the part on a leveling plate and roll a dial indicator across it. The leveling plate is not required for a true flatness check but using this will also work for parallelism of lead base to top of body.
Electronics Forum | Fri Aug 07 01:02:51 EDT 1998 | zeek - just wanna to get a word in here
| | I am looking for advice or information from anyone about the possible reliability problems associated with epoxy on solder pads of discrete devices. Will the epoxy expand and lift over time, Will there be adverse reaction between the solder and t
Electronics Forum | Thu Jan 18 15:47:52 EST 2007 | Jeff
>What was your package temp during this reflow process? I >>know you had balls at 245 but what about the case itself? I did not measure the temperature of a package. My thermocouples are 36AWG - around 0.01" diameter, so about the only way I imagine
Electronics Forum | Wed Oct 20 09:27:31 EDT 1999 | Bill Strachan
I suggest that you get a copy of IPC -SM-782A 'Surface Mount Design and Land Pattern Standard'. This gives component dimensions and recommended land patterns for nearl all surface mount components. You could also benmefit from a copy of TopLine Dummy
Electronics Forum | Thu Jul 24 07:52:58 EDT 2008 | davef
We assume the silk screen is epoxy. If so,: * Easiest: 'black-box' the undesired area by printing epoxy on top of the undesired area. You could use a stamp-pad easily. * Fairly-easy-but-messy: use a Dremmel-type tool to remove the undesired area. Thi
Electronics Forum | Fri May 24 09:34:57 EDT 2013 | markhoch
I run the same profiles for Top and Bottomside assemblies for all of my products. Only in rare instances have I been forced to run a profile with cooler bottom zone settings. This was obviously driven by assemblies with heavier components on the bott
Electronics Forum | Mon May 16 12:42:59 EDT 2005 | adrian_nishimoto
We have a customer that has been trying to place the Xilinx part number XCV2000E-6FG1156I which is an 1156 ball plastic BGA. When we do the X-ray and inspection we find that the package is warping up on all four corners of the package, Like so: Top
Electronics Forum | Fri Jan 19 10:43:28 EST 2007 | jimmyjames
You guys are all joking right?! There aren't any contaminates in your solder, the different colors on the surface are completely normal and even expected. The top layer of solder oxidizes and the structure of the surface resembles crystals, refract
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
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