Electronics Forum | Mon Aug 30 16:10:10 EDT 1999 | Dave F
| I have looked through the IPC web page and surfed to frustration. Can somebody give me a lead? | Brian: We don't use an etched board. We use a special stencil, described below and print on bare copper laminate. 3 Solder Wetting Test. Recogniz
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Wed Jan 11 22:47:31 EST 2006 | davef
We didn't intend to light anyone's fur on fire [get anyone's underwear in a knot, roil the waters, have a cow man] about consultants. The Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste
Electronics Forum | Thu May 26 08:52:42 EDT 2011 | davef
Phil Zarrow wrote a useful paper that could help in evaluating paste. Here read it ... Evaluating Solder Paste � Not An Option Contributed by Phil Zarrow of ITM an Independent SMT consulting firm With soldering being the dominant source of assembly
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Fri Nov 05 15:02:53 EST 2004 | James Callender
Hey, I'm a student who is trying to etch my own circuit boards (for an art class surprisingly). Does anyone know where I could purchase a copper clad board that uses a transparent laminate? Transparency is sort of important, as this project is more
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
Electronics Forum | Tue Feb 12 10:33:45 EST 2002 | davef
IPC-4101 - Specification For Base Materials For Rigid And Multilayer Boards replaces MIL-P-13949 - Plastic Sheet, Laminated, Copper-Clad (For Printed Wiring) Taking a broader look, there are many �Obsolete MIL Document To Commercial Document� replac
Electronics Forum | Fri Jul 24 03:23:34 EDT 2020 | xinyao
So I got this fully auto running machine line, that automatically pick, cut, edge grind, corner round the copper clad laminate, and I do not have a professional camara to shoot a video. How can shoot it with my phone, and still it looks amazing? Than
Electronics Forum | Fri May 25 08:06:19 EDT 2007 | davef
Soldering PTFE boards * Exposure to the high temperatures needed for solder reflow poses no problem of loss of peel strength since the exposure times are relatively short. * There are many different types of PTFE based products that may perform diff
